JPS5599930A - Surface modification - Google Patents

Surface modification

Info

Publication number
JPS5599930A
JPS5599930A JP671779A JP671779A JPS5599930A JP S5599930 A JPS5599930 A JP S5599930A JP 671779 A JP671779 A JP 671779A JP 671779 A JP671779 A JP 671779A JP S5599930 A JPS5599930 A JP S5599930A
Authority
JP
Japan
Prior art keywords
partial
sio
formula
alkyl group
hydrolyzate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP671779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS624059B2 (enrdf_load_stackoverflow
Inventor
Toshiyuki Iwahashi
Masahiro Yamazaki
Takanobu Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP671779A priority Critical patent/JPS5599930A/ja
Publication of JPS5599930A publication Critical patent/JPS5599930A/ja
Publication of JPS624059B2 publication Critical patent/JPS624059B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP671779A 1979-01-23 1979-01-23 Surface modification Granted JPS5599930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP671779A JPS5599930A (en) 1979-01-23 1979-01-23 Surface modification

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP671779A JPS5599930A (en) 1979-01-23 1979-01-23 Surface modification

Publications (2)

Publication Number Publication Date
JPS5599930A true JPS5599930A (en) 1980-07-30
JPS624059B2 JPS624059B2 (enrdf_load_stackoverflow) 1987-01-28

Family

ID=11646009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP671779A Granted JPS5599930A (en) 1979-01-23 1979-01-23 Surface modification

Country Status (1)

Country Link
JP (1) JPS5599930A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11335625A (ja) * 1998-05-25 1999-12-07 Matsushita Electric Works Ltd コーティング用樹脂組成物とこれを用いた塗装品
WO2002051897A3 (en) * 2000-12-22 2002-09-12 Basf Corp Coating system containing modified crosslinkers
JP2008501825A (ja) * 2004-06-01 2008-01-24 ダウ コーニング コーポレーション ナノ及びマイクロリソグラフィー用の材料組成物
US7714080B2 (en) 2005-03-07 2010-05-11 Shin-Etsu Chemical Co., Ltd. Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4880175A (enrdf_load_stackoverflow) * 1972-01-31 1973-10-26
JPS50132076A (enrdf_load_stackoverflow) * 1974-04-08 1975-10-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4880175A (enrdf_load_stackoverflow) * 1972-01-31 1973-10-26
JPS50132076A (enrdf_load_stackoverflow) * 1974-04-08 1975-10-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11335625A (ja) * 1998-05-25 1999-12-07 Matsushita Electric Works Ltd コーティング用樹脂組成物とこれを用いた塗装品
WO2002051897A3 (en) * 2000-12-22 2002-09-12 Basf Corp Coating system containing modified crosslinkers
JP2008501825A (ja) * 2004-06-01 2008-01-24 ダウ コーニング コーポレーション ナノ及びマイクロリソグラフィー用の材料組成物
US7714080B2 (en) 2005-03-07 2010-05-11 Shin-Etsu Chemical Co., Ltd. Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device

Also Published As

Publication number Publication date
JPS624059B2 (enrdf_load_stackoverflow) 1987-01-28

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