JPS559435A - Composite wire - Google Patents

Composite wire

Info

Publication number
JPS559435A
JPS559435A JP8209878A JP8209878A JPS559435A JP S559435 A JPS559435 A JP S559435A JP 8209878 A JP8209878 A JP 8209878A JP 8209878 A JP8209878 A JP 8209878A JP S559435 A JPS559435 A JP S559435A
Authority
JP
Japan
Prior art keywords
composite wire
copper
diameter
crystals
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8209878A
Other languages
Japanese (ja)
Inventor
Yoshimi Watanabe
Kunio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8209878A priority Critical patent/JPS559435A/en
Publication of JPS559435A publication Critical patent/JPS559435A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE:To prevent leak generation when sealed with soft glass by making a core wire of Zr added copper and covering with Fe-Ni alloy. CONSTITUTION:A 6.6mm diameter bar of copper added with 0.3% Zr is inserted into a pipe of 20mm outside diameter and 6mm wall thickness made of 50% Fe-Ni, and they are cold drawn and hot drawn into a composite wire. Being applied cold drawing and intermediate annealing repeatedly, the composite wire is finished to a composite wire of 1mm diameter. By so constructing, crystals do not grow coarse but become fine grain sized and the number of crystal grains becomes 150 times that of usual ones. Therefore, the crystals of the copper core wire and the Fe-Ni alloy mesh with each other and combine firmly, and leak when sealed with soft glass can be prevented.
JP8209878A 1978-07-07 1978-07-07 Composite wire Pending JPS559435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8209878A JPS559435A (en) 1978-07-07 1978-07-07 Composite wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8209878A JPS559435A (en) 1978-07-07 1978-07-07 Composite wire

Publications (1)

Publication Number Publication Date
JPS559435A true JPS559435A (en) 1980-01-23

Family

ID=13764934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8209878A Pending JPS559435A (en) 1978-07-07 1978-07-07 Composite wire

Country Status (1)

Country Link
JP (1) JPS559435A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57117556A (en) * 1981-01-12 1982-07-22 Japan Synthetic Rubber Co Ltd Thermoplastic resin composition
JPS5838406A (en) * 1981-08-29 1983-03-05 住友電気工業株式会社 Dumet wire
JPS5840350A (en) * 1981-09-04 1983-03-09 Asahi Chem Ind Co Ltd Thermoplastic graft copolymer composition
JPS61235456A (en) * 1985-04-10 1986-10-20 Unitika Ltd Polyester resin composition
US4877831A (en) * 1986-06-17 1989-10-31 Mitsubishi Rayon Co., Ltd. Polycarbonate resin composition
US5187227A (en) * 1990-07-06 1993-02-16 Nippon Zeon Co., Ltd. Polycarbonate resin composition
US5367016A (en) * 1991-11-28 1994-11-22 Kanegafuchi Chemical Industry Co., Ltd. Reinforced resin composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57117556A (en) * 1981-01-12 1982-07-22 Japan Synthetic Rubber Co Ltd Thermoplastic resin composition
JPS6361971B2 (en) * 1981-01-12 1988-11-30
JPS5838406A (en) * 1981-08-29 1983-03-05 住友電気工業株式会社 Dumet wire
JPS6322402B2 (en) * 1981-08-29 1988-05-11 Sumitomo Electric Industries
JPS5840350A (en) * 1981-09-04 1983-03-09 Asahi Chem Ind Co Ltd Thermoplastic graft copolymer composition
JPS6230225B2 (en) * 1981-09-04 1987-07-01 Asahi Chemical Ind
JPS61235456A (en) * 1985-04-10 1986-10-20 Unitika Ltd Polyester resin composition
JPH0569136B2 (en) * 1985-04-10 1993-09-30 Unitika Ltd
US4877831A (en) * 1986-06-17 1989-10-31 Mitsubishi Rayon Co., Ltd. Polycarbonate resin composition
US5187227A (en) * 1990-07-06 1993-02-16 Nippon Zeon Co., Ltd. Polycarbonate resin composition
US5367016A (en) * 1991-11-28 1994-11-22 Kanegafuchi Chemical Industry Co., Ltd. Reinforced resin composition

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