JPS559410A - Method of and device for printing etching resist ink to copper through hole substrate - Google Patents

Method of and device for printing etching resist ink to copper through hole substrate

Info

Publication number
JPS559410A
JPS559410A JP8145778A JP8145778A JPS559410A JP S559410 A JPS559410 A JP S559410A JP 8145778 A JP8145778 A JP 8145778A JP 8145778 A JP8145778 A JP 8145778A JP S559410 A JPS559410 A JP S559410A
Authority
JP
Japan
Prior art keywords
copper
etching resist
resist ink
hole substrate
printing etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8145778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS635917B2 (enrdf_load_stackoverflow
Inventor
Hiroshige Sawa
Takaaki Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP8145778A priority Critical patent/JPS559410A/ja
Publication of JPS559410A publication Critical patent/JPS559410A/ja
Publication of JPS635917B2 publication Critical patent/JPS635917B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP8145778A 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate Granted JPS559410A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8145778A JPS559410A (en) 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8145778A JPS559410A (en) 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate

Publications (2)

Publication Number Publication Date
JPS559410A true JPS559410A (en) 1980-01-23
JPS635917B2 JPS635917B2 (enrdf_load_stackoverflow) 1988-02-05

Family

ID=13746923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8145778A Granted JPS559410A (en) 1978-07-06 1978-07-06 Method of and device for printing etching resist ink to copper through hole substrate

Country Status (1)

Country Link
JP (1) JPS559410A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137978A (ja) * 1983-12-27 1985-07-22 Dainippon Ink & Chem Inc 水性コンタクト接着剤
JPS62112615A (ja) * 1985-11-07 1987-05-23 ヒユ−ルス・アクチエンゲゼルシヤフト 熱可塑性材料の製造法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509344A (enrdf_load_stackoverflow) * 1973-05-22 1975-01-30
JPS52120954U (enrdf_load_stackoverflow) * 1976-02-18 1977-09-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509344A (enrdf_load_stackoverflow) * 1973-05-22 1975-01-30
JPS52120954U (enrdf_load_stackoverflow) * 1976-02-18 1977-09-14

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137978A (ja) * 1983-12-27 1985-07-22 Dainippon Ink & Chem Inc 水性コンタクト接着剤
JPS62112615A (ja) * 1985-11-07 1987-05-23 ヒユ−ルス・アクチエンゲゼルシヤフト 熱可塑性材料の製造法

Also Published As

Publication number Publication date
JPS635917B2 (enrdf_load_stackoverflow) 1988-02-05

Similar Documents

Publication Publication Date Title
JPS5570025A (en) Device for projecting and printing mark of mask on semiconductor substrate
JPS5516499A (en) Method of and device for manufacturing printed circuit board and printed circuit board
DE2861271D1 (en) Method for the removal of matter from a substrate by selective dry etching and application of this method to the manufacture of conductive patterns
JPS5527647A (en) Paint for forming insulating film of conductive printed circuit board and method of forming insulating film
JPS559410A (en) Method of and device for printing etching resist ink to copper through hole substrate
JPS5561088A (en) Device for mounting electronic part to printed substrate
JPS5562794A (en) Method of regnerating printed circuit board surface cleanser
JPS5364770A (en) Method of etching printed circuit board
JPS5546989A (en) Etching method of substrate by jet printing
JPS5256366A (en) Method of conducting bothhside printed substrate
JPS54158674A (en) Method of positioning component on printed board
JPS5419178A (en) Method of making print wiring substrate
JPS5466466A (en) Method of mounting electronic parts to print substrate and its device
JPS5550686A (en) Method of marking printed circuit board
JPS5393367A (en) Method of temporarily securing electronic part to printed substrate
JPS559459A (en) Method of manufacturing oneeside through hole printed circuit board
JPS54102567A (en) Method of producing doubleesided through hole printed circuit
JPS559470A (en) Method of forming printed substrate
JPS5466470A (en) Method of dividing printed circuit substrate
JPS54103553A (en) Through hole working method of printed circuit board
JPS57153494A (en) Method of printing solder resist on printed board
JPS5413965A (en) Method of making print wiring substrate
JPS5526679A (en) Method of manufacturing through hole printed board
JPS52138671A (en) Method of producing printed circuit substrate
JPS52124172A (en) Method of producing printed circuit substrate