JPS5590405A - Forming device for wet oxygen and heat treatment furnace provided with the said device - Google Patents

Forming device for wet oxygen and heat treatment furnace provided with the said device

Info

Publication number
JPS5590405A
JPS5590405A JP15986078A JP15986078A JPS5590405A JP S5590405 A JPS5590405 A JP S5590405A JP 15986078 A JP15986078 A JP 15986078A JP 15986078 A JP15986078 A JP 15986078A JP S5590405 A JPS5590405 A JP S5590405A
Authority
JP
Japan
Prior art keywords
oxygen
hydrogen
vessel
pipe
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15986078A
Other languages
Japanese (ja)
Other versions
JPS6360528B2 (en
Inventor
Tamotsu Sasaki
Masamoto Akeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15986078A priority Critical patent/JPS5590405A/en
Publication of JPS5590405A publication Critical patent/JPS5590405A/en
Publication of JPS6360528B2 publication Critical patent/JPS6360528B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Oxygen, Ozone, And Oxides In General (AREA)

Abstract

PURPOSE: To form the titled device that does not disturb the distribution of temperature in a treatment chamber by a mechanism wherein an oxygen feed mechanism, a hydrogen feed mechanism, which can heat a nose portion of a nozzle, and a mechanism for drawing out a gas mixture created are mounted to an airtight vessel.
CONSTITUTION: An oxygen feed pipe 15, a hydrogen feed pipe 14, to which a spiral heater 16 for heating a surrounding portion of a nozzle portion 18 is additionally installed, and a conduit 19, which draws out a mixed gas (wet oxygen) of steam and oxygen produced by a reaction of oxygen and hydrogen and supplies the mixed gas to a furnace core pipe 26 through an auxiliary conduit 28, are arranged to an airtight vessel 8 (it is manufactured so as to make up the three layer structure of a quartz glass box 10, a heat insulating layer 12 and a metallic vessel 11). The said devices are used in such a manner that hydrogen jetted from the nozzle 18, which temperature is brought to a fixed temperature by means of the heater 16, and oxygen, which is supplied from the pipe 15 and is filled in the vessel 8, are reacted and the wet oxygen formed is fed to the furnace core pipe 26 from the conduit 19.
COPYRIGHT: (C)1980,JPO&Japio
JP15986078A 1978-12-27 1978-12-27 Forming device for wet oxygen and heat treatment furnace provided with the said device Granted JPS5590405A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15986078A JPS5590405A (en) 1978-12-27 1978-12-27 Forming device for wet oxygen and heat treatment furnace provided with the said device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15986078A JPS5590405A (en) 1978-12-27 1978-12-27 Forming device for wet oxygen and heat treatment furnace provided with the said device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP10458184A Division JPS60122799A (en) 1984-05-25 1984-05-25 Heat treatment of semiconductor wafer
JP10458284A Division JPS60131807A (en) 1984-05-25 1984-05-25 Apparatus for producing wet oxygen atmosphere

Publications (2)

Publication Number Publication Date
JPS5590405A true JPS5590405A (en) 1980-07-09
JPS6360528B2 JPS6360528B2 (en) 1988-11-24

Family

ID=15702797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15986078A Granted JPS5590405A (en) 1978-12-27 1978-12-27 Forming device for wet oxygen and heat treatment furnace provided with the said device

Country Status (1)

Country Link
JP (1) JPS5590405A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856435U (en) * 1981-10-12 1983-04-16 沖電気工業株式会社 Semiconductor wafer heat treatment equipment
JPS5895633U (en) * 1981-12-23 1983-06-29 クラリオン株式会社 Hydrogen combustion process tube

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123667A (en) * 1977-04-04 1978-10-28 Mitsubishi Electric Corp Generator for semiconuctor oxidized film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123667A (en) * 1977-04-04 1978-10-28 Mitsubishi Electric Corp Generator for semiconuctor oxidized film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856435U (en) * 1981-10-12 1983-04-16 沖電気工業株式会社 Semiconductor wafer heat treatment equipment
JPS5895633U (en) * 1981-12-23 1983-06-29 クラリオン株式会社 Hydrogen combustion process tube

Also Published As

Publication number Publication date
JPS6360528B2 (en) 1988-11-24

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