JPS5582606A - Cleaning method and device for plastic resin mold - Google Patents

Cleaning method and device for plastic resin mold

Info

Publication number
JPS5582606A
JPS5582606A JP15889078A JP15889078A JPS5582606A JP S5582606 A JPS5582606 A JP S5582606A JP 15889078 A JP15889078 A JP 15889078A JP 15889078 A JP15889078 A JP 15889078A JP S5582606 A JPS5582606 A JP S5582606A
Authority
JP
Japan
Prior art keywords
mold
resins
nozzle
solid particles
minute solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15889078A
Other languages
Japanese (ja)
Inventor
Akihiro Kubota
Masao Takehiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15889078A priority Critical patent/JPS5582606A/en
Publication of JPS5582606A publication Critical patent/JPS5582606A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To enable an efficient cleaning of contaminants adhered to a mold surface, by removing residual resins adhered to the mold surface by blasting air, whose temperature is sufficiently lower than that of a mold, and minute solid particles against a surface, wherein a molding cavity of a plastic resin mold is formed, immediately after molding is complete. CONSTITUTION:A cleaning head 15 is built into a cleaning device proper provided with a system reciprocating between an upper and a lower molds, an air nozzle 20, and a nozzle 21 which ejects particles such as minute walnut particles, etc., being located adjacent the end thereof. The cleaning head 15 is inserted into a mold 12 heated to high temperature immediately after a molding process. High pressure air having room temperature is then injected from the nozzle 20, minute solid particles are ejected from the nozzle 21 together with the high pressure air. This causes a rapid contraction of resins adhered to a cavity 12' of the mold 12, and as a result, an adhesion force thereof reduces sharply. In addition, the minute solid particles collide with the resins at a high speed, whereby the resins fall off from the mold 12. The resins are then exhausted together with the minute solid particles through an exhaust port 17 connected to a vacuum suction system.
JP15889078A 1978-12-20 1978-12-20 Cleaning method and device for plastic resin mold Pending JPS5582606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15889078A JPS5582606A (en) 1978-12-20 1978-12-20 Cleaning method and device for plastic resin mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15889078A JPS5582606A (en) 1978-12-20 1978-12-20 Cleaning method and device for plastic resin mold

Publications (1)

Publication Number Publication Date
JPS5582606A true JPS5582606A (en) 1980-06-21

Family

ID=15681609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15889078A Pending JPS5582606A (en) 1978-12-20 1978-12-20 Cleaning method and device for plastic resin mold

Country Status (1)

Country Link
JP (1) JPS5582606A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761850U (en) * 1980-09-29 1982-04-13
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device
EP1055496A2 (en) * 1999-05-26 2000-11-29 Rampf Formen GmbH Cleaning device for forming elements
CN103624898A (en) * 2012-07-20 2014-03-12 名硕电脑(苏州)有限公司 Mold having chip removal function

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761850U (en) * 1980-09-29 1982-04-13
JPS6311743Y2 (en) * 1980-09-29 1988-04-05
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device
JPS6361775B2 (en) * 1983-05-06 1988-11-30
EP1055496A2 (en) * 1999-05-26 2000-11-29 Rampf Formen GmbH Cleaning device for forming elements
EP1055496A3 (en) * 1999-05-26 2002-01-09 Rampf Formen GmbH Cleaning device for forming elements
CN103624898A (en) * 2012-07-20 2014-03-12 名硕电脑(苏州)有限公司 Mold having chip removal function
CN103624898B (en) * 2012-07-20 2016-05-04 名硕电脑(苏州)有限公司 There is the mould of chip removal function

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