JPS55137914A - Cleaning method for semiconductor producing device - Google Patents

Cleaning method for semiconductor producing device

Info

Publication number
JPS55137914A
JPS55137914A JP4593279A JP4593279A JPS55137914A JP S55137914 A JPS55137914 A JP S55137914A JP 4593279 A JP4593279 A JP 4593279A JP 4593279 A JP4593279 A JP 4593279A JP S55137914 A JPS55137914 A JP S55137914A
Authority
JP
Japan
Prior art keywords
sheet
resins
stripped
contaminants
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4593279A
Other languages
Japanese (ja)
Inventor
Seiji Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP4593279A priority Critical patent/JPS55137914A/en
Publication of JPS55137914A publication Critical patent/JPS55137914A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To easily remove a foreign material and contaminants on a mold surface, a cavity and the like, by a method wherein adherent thermoplastic resin stuck on a heat-resisting sheet at heated and pressurized in a mold, and the sheet so processed is stripped. CONSTITUTION:Resin 14, such as preformed melamine resins or epoxy resins, are stuck on a heat-resisting paper, cloth, sheet, or net made of fine metal wires and the like 15. So processed sheet clamped by molds is heated and pressure-cured. When the mold is opened and the heated, pressure-cured sheet is stripped off a mold surface after curing is complete, all foreign materials and contaminants, such as resins and the like choked at air bents 13, cavities 7, and runners 4, are adhered to the melamine resins to be stripped, since the said resins have a strong adhesion. Contaminants of the mold surface and ones on the cavities 7 and runners 4 can thus be cleaned simultaneously.
JP4593279A 1979-04-13 1979-04-13 Cleaning method for semiconductor producing device Pending JPS55137914A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4593279A JPS55137914A (en) 1979-04-13 1979-04-13 Cleaning method for semiconductor producing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4593279A JPS55137914A (en) 1979-04-13 1979-04-13 Cleaning method for semiconductor producing device

Publications (1)

Publication Number Publication Date
JPS55137914A true JPS55137914A (en) 1980-10-28

Family

ID=12733030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4593279A Pending JPS55137914A (en) 1979-04-13 1979-04-13 Cleaning method for semiconductor producing device

Country Status (1)

Country Link
JP (1) JPS55137914A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236834A (en) * 1985-08-10 1987-02-17 Fujitsu Ltd Resin sealing apparatus and method
WO1987003531A1 (en) * 1985-12-13 1987-06-18 Pas Ireneus Johannes Theodorus Method and composite article for cleaning molds
EP0271107A2 (en) * 1986-12-11 1988-06-15 Nitto Denko Corporation Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet
JPS63148645A (en) * 1986-12-11 1988-06-21 Kyushu Nitto Denko Kk Manufacture of semiconductor device
JPH0195010A (en) * 1987-10-07 1989-04-13 Matsushita Electron Corp Cleaning method for molding die
JPH07273135A (en) * 1995-01-05 1995-10-20 Nitto Denko Corp Manufacture of semiconductor device
EP0704292A1 (en) * 1994-03-30 1996-04-03 Sankyokasei Kabushiki Kaisha Resin molding method and resin molding machine
JPH11207752A (en) * 1998-01-26 1999-08-03 Hitachi Ltd Sheet for preventing oxidation of molding die and method for preventing oxidation of molding die using sheet
CN1058929C (en) * 1997-03-20 2000-11-29 超丰电子股份有限公司 Mold washing method improvement for thermosetting plastic injection forming mold
KR20030016022A (en) * 2001-08-20 2003-02-26 다이몬지 카부시키 카이샤 Non-weaving cloth and method of the same
KR100458657B1 (en) * 1996-12-10 2005-04-06 닛토덴코 가부시키가이샤 Cleaning composition for molds for forming semiconductor devices and cleaning method of molds using the same
JP2007196586A (en) * 2006-01-27 2007-08-09 Nitto Denko Corp Mold regenerating sheet
JP2007196587A (en) * 2006-01-27 2007-08-09 Nitto Denko Corp Mold regenerating sheet
WO2008108327A1 (en) * 2007-03-05 2008-09-12 Nitto Denko Corporation Sheet for mold regeneration and method of cleaning mold with the same
JP2008300856A (en) * 2008-07-11 2008-12-11 Renesas Technology Corp Semiconductor device manufacturing method

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236834A (en) * 1985-08-10 1987-02-17 Fujitsu Ltd Resin sealing apparatus and method
WO1987003531A1 (en) * 1985-12-13 1987-06-18 Pas Ireneus Johannes Theodorus Method and composite article for cleaning molds
EP0271107A2 (en) * 1986-12-11 1988-06-15 Nitto Denko Corporation Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet
JPS63148645A (en) * 1986-12-11 1988-06-21 Kyushu Nitto Denko Kk Manufacture of semiconductor device
JPH0195010A (en) * 1987-10-07 1989-04-13 Matsushita Electron Corp Cleaning method for molding die
EP0704292A1 (en) * 1994-03-30 1996-04-03 Sankyokasei Kabushiki Kaisha Resin molding method and resin molding machine
EP0704292A4 (en) * 1994-03-30 1996-12-27 Sankyokasei Kabushiki Kaisha Resin molding method and resin molding machine
JPH07273135A (en) * 1995-01-05 1995-10-20 Nitto Denko Corp Manufacture of semiconductor device
KR100458657B1 (en) * 1996-12-10 2005-04-06 닛토덴코 가부시키가이샤 Cleaning composition for molds for forming semiconductor devices and cleaning method of molds using the same
CN1058929C (en) * 1997-03-20 2000-11-29 超丰电子股份有限公司 Mold washing method improvement for thermosetting plastic injection forming mold
JPH11207752A (en) * 1998-01-26 1999-08-03 Hitachi Ltd Sheet for preventing oxidation of molding die and method for preventing oxidation of molding die using sheet
KR20030016022A (en) * 2001-08-20 2003-02-26 다이몬지 카부시키 카이샤 Non-weaving cloth and method of the same
JP2007196586A (en) * 2006-01-27 2007-08-09 Nitto Denko Corp Mold regenerating sheet
JP2007196587A (en) * 2006-01-27 2007-08-09 Nitto Denko Corp Mold regenerating sheet
WO2008108327A1 (en) * 2007-03-05 2008-09-12 Nitto Denko Corporation Sheet for mold regeneration and method of cleaning mold with the same
JP2008213313A (en) * 2007-03-05 2008-09-18 Nitto Denko Corp Sheet for regeneration of mold and mold cleaning method using the sheet
JP2008300856A (en) * 2008-07-11 2008-12-11 Renesas Technology Corp Semiconductor device manufacturing method

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