JPS5580884A - Magnetic bubble memory wafer - Google Patents

Abstract

PURPOSE: To ensure the high-efficiency heating as well as to avoid increment of the processes without impairing the input/output terminal used for the test of the probe card or the like by forming the electric conduction pattern on the wafer in order to secure the heating for the chip test.

CONSTITUTION: Conduction pattern 18 which is formed in the same process as formation of the driving pattern or the like of plural number of magnetic bubble chip 8 is distributed on wafer 14 as if it detoured around each chip 8 to be connected to the heating power source via connection terminal 19. Pattern 18 is set at the position where no effect is given to the shift of the magnetic bubble, for example, on the cutting line in case each chip 8 is cut out of wafer 14. For the high-temperature test, the current which gives the energy necessary for the test is flowed to pattern 18 after setting probe card 15 to test chip 8. Unlike the conventional way in that the temperature of chip 8 is increased via the heat generation of driving coils 16 and 17, the heating efficiency can be improved. At the same time, the malformation, breakdown and the like can be avoided for the control circuit system of card 15, or eliminating the spraying operation of the cooling gas.

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