JPS5575421A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5575421A JPS5575421A JP14782678A JP14782678A JPS5575421A JP S5575421 A JPS5575421 A JP S5575421A JP 14782678 A JP14782678 A JP 14782678A JP 14782678 A JP14782678 A JP 14782678A JP S5575421 A JPS5575421 A JP S5575421A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- imidazole
- oxalic acid
- adipic acid
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To provide an epoxy resin composition with enhanced hardenability and preserve stability by including a reaction product of imidazole, adipic acid and oxalic acid and benzyl alcohol to epoxy resin.
CONSTITUTION: To epoxy resin, is compounded a reaction product obtained by reacting adipic acid and oxalic acid successively with one or more groups selected from imidazole and imidazole derivative as a hardener. As imidazole derivative to be used, 2-ethylimidazole, 2-ethyl-4-methylimidazole or the like are designated. The reaction mol ratio of adipic acid and oxalic acid to imidazole and the derivative thereof is within the range of 1.80W1.15mol of adipic acid and 0.20W0.85mol of oxalic acid per one mol of imidazoles and the reaction is preferably carried out in the range of 80W15mol% of adipic acid and 20W85mol% of oxalic acid.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14782678A JPS5575421A (en) | 1978-12-01 | 1978-12-01 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14782678A JPS5575421A (en) | 1978-12-01 | 1978-12-01 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5575421A true JPS5575421A (en) | 1980-06-06 |
Family
ID=15439099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14782678A Pending JPS5575421A (en) | 1978-12-01 | 1978-12-01 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5575421A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255991A (en) * | 1994-10-27 | 1996-10-01 | Samsung Electro Mech Co Ltd | Method and equipment for manufacturing beat filter |
| EP1646054A1 (en) * | 2003-07-11 | 2006-04-12 | Ube Industries, Ltd. | Acid-base mixture and ion conductor composed of such mixture |
| US7148294B2 (en) * | 2001-03-30 | 2006-12-12 | Toray Industries, Inc. | Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials |
-
1978
- 1978-12-01 JP JP14782678A patent/JPS5575421A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255991A (en) * | 1994-10-27 | 1996-10-01 | Samsung Electro Mech Co Ltd | Method and equipment for manufacturing beat filter |
| US7148294B2 (en) * | 2001-03-30 | 2006-12-12 | Toray Industries, Inc. | Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials |
| US7501087B2 (en) | 2001-03-30 | 2009-03-10 | Toray Industries, Inc. | Injection molding thermosetting resin composition into reinforcing fiber substrate |
| EP1646054A1 (en) * | 2003-07-11 | 2006-04-12 | Ube Industries, Ltd. | Acid-base mixture and ion conductor composed of such mixture |
| EP1646054A4 (en) * | 2003-07-11 | 2010-05-19 | Ube Industries | Acid-base mixture and ion conductor composed of such mixture |
| US8308970B2 (en) | 2003-07-11 | 2012-11-13 | Ube Industries, Ltd. | Acid-base mixture and ion conductor comprising the same |
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