JPS5565927A - Liquid crystal display panel - Google Patents

Liquid crystal display panel

Info

Publication number
JPS5565927A
JPS5565927A JP8377478A JP8377478A JPS5565927A JP S5565927 A JPS5565927 A JP S5565927A JP 8377478 A JP8377478 A JP 8377478A JP 8377478 A JP8377478 A JP 8377478A JP S5565927 A JPS5565927 A JP S5565927A
Authority
JP
Japan
Prior art keywords
films
addition
substrates
bismaleid
transparent conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8377478A
Other languages
Japanese (ja)
Other versions
JPS6253809B2 (en
Inventor
Yuji Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP8377478A priority Critical patent/JPS5565927A/en
Publication of JPS5565927A publication Critical patent/JPS5565927A/en
Publication of JPS6253809B2 publication Critical patent/JPS6253809B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)

Abstract

PURPOSE: To obtain stable horizontal orientation effect by using the addition-polymerization type thermosetting resin of organic cyanate and bismaleimide as the orientation treating films of the plastic substrates provided with transparent conductive films.
CONSTITUTION: Transparent conductive films 2 conposed of indium oxide, etc. are provided on plastic substrates 1 composed of polyester, etc. and the orientation treatment films 5 composed of the addition-polymerization type thermosetting resins of organic cynate and bismaleid are formed thereon. Methods such as those involving dipping the substrates in the solution comprising dissolving organic cyanate and bismaleid to a keton-base solvent or spraying the solution to the substrates then removing the solvent through hot air drying thence baking the same by using necessary temperature and time required for addition-polymerization are used for the method of forming the abovementioned treatment films 5.
COPYRIGHT: (C)1980,JPO&Japio
JP8377478A 1978-07-10 1978-07-10 Liquid crystal display panel Granted JPS5565927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8377478A JPS5565927A (en) 1978-07-10 1978-07-10 Liquid crystal display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8377478A JPS5565927A (en) 1978-07-10 1978-07-10 Liquid crystal display panel

Publications (2)

Publication Number Publication Date
JPS5565927A true JPS5565927A (en) 1980-05-17
JPS6253809B2 JPS6253809B2 (en) 1987-11-12

Family

ID=13811943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8377478A Granted JPS5565927A (en) 1978-07-10 1978-07-10 Liquid crystal display panel

Country Status (1)

Country Link
JP (1) JPS5565927A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167124A (en) * 1980-05-27 1981-12-22 Matsushita Electric Ind Co Ltd Liquid crystal display panel and its manufacture
CN112280329A (en) * 2019-07-24 2021-01-29 宏泰电工股份有限公司 Resin composition for printed wiring board, metal-clad substrate, and printed wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167124A (en) * 1980-05-27 1981-12-22 Matsushita Electric Ind Co Ltd Liquid crystal display panel and its manufacture
CN112280329A (en) * 2019-07-24 2021-01-29 宏泰电工股份有限公司 Resin composition for printed wiring board, metal-clad substrate, and printed wiring board
CN112280329B (en) * 2019-07-24 2022-08-02 宏泰电工股份有限公司 Resin composition for printed wiring board, metal-clad substrate, and printed wiring board

Also Published As

Publication number Publication date
JPS6253809B2 (en) 1987-11-12

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