JPS5565494A - Method of manufacturing precise metallic lug on film support and film support having same lug - Google Patents
Method of manufacturing precise metallic lug on film support and film support having same lugInfo
- Publication number
- JPS5565494A JPS5565494A JP14271579A JP14271579A JPS5565494A JP S5565494 A JPS5565494 A JP S5565494A JP 14271579 A JP14271579 A JP 14271579A JP 14271579 A JP14271579 A JP 14271579A JP S5565494 A JPS5565494 A JP S5565494A
- Authority
- JP
- Japan
- Prior art keywords
- film support
- lug
- same
- manufacturing precise
- precise metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Resistance Welding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7831121A FR2440615A1 (fr) | 1978-11-03 | 1978-11-03 | Procede de fabrication de bossages metalliques calibres sur un film support et film support comportant de tels bossages |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5565494A true JPS5565494A (en) | 1980-05-16 |
Family
ID=9214431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14271579A Pending JPS5565494A (en) | 1978-11-03 | 1979-11-02 | Method of manufacturing precise metallic lug on film support and film support having same lug |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0011013B1 (ja) |
JP (1) | JPS5565494A (ja) |
DE (1) | DE2962240D1 (ja) |
FR (1) | FR2440615A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5824037B2 (ja) * | 1980-05-26 | 1983-05-18 | 富士通株式会社 | 導体ボ−ル配列方法 |
FR2728392A1 (fr) * | 1994-12-16 | 1996-06-21 | Bull Sa | Procede et support de connexion d'un circuit integre a un autre support par l'intermediaire de boules |
US5844168A (en) * | 1995-08-01 | 1998-12-01 | Minnesota Mining And Manufacturing Company | Multi-layer interconnect sutructure for ball grid arrays |
US5663530A (en) * | 1995-08-01 | 1997-09-02 | Minnesota Mining And Manufacturing Company | Wire bond tape ball grid array package |
KR100211814B1 (ko) * | 1995-11-30 | 1999-08-02 | 전주범 | 플라이백 트랜스포머의 가요성 2차코일 권선구조와 그 제조방법 |
US5853517A (en) * | 1996-11-08 | 1998-12-29 | W. L. Gore & Associates, Inc. | Method for coining solder balls on an electrical circuit package |
FR2844733B1 (fr) * | 2002-09-25 | 2005-05-06 | Novatec Sa Soc | Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle |
FR2940521B1 (fr) | 2008-12-19 | 2011-11-11 | 3D Plus | Procede de fabrication collective de modules electroniques pour montage en surface |
DE102010004112A1 (de) | 2009-06-29 | 2010-12-30 | Bosch Solar Energy Ag | Verfahren zur Herstellung eines folienartigen elektrischen Verbinders für Solarzellen, derartig hergestelltes Verbindungselement sowie Verfahren zum elektrischen Verbinden von mindestens zwei Solarzellen zu einem Solarmodul |
CN111148427B (zh) * | 2019-12-31 | 2021-01-12 | 无锡市同步电子制造有限公司 | 垛形/i形预置焊料端子连接器的返修工艺 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
-
1978
- 1978-11-03 FR FR7831121A patent/FR2440615A1/fr active Granted
-
1979
- 1979-10-17 EP EP19790400759 patent/EP0011013B1/fr not_active Expired
- 1979-10-17 DE DE7979400759T patent/DE2962240D1/de not_active Expired
- 1979-11-02 JP JP14271579A patent/JPS5565494A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2440615B1 (ja) | 1982-11-19 |
EP0011013B1 (fr) | 1982-03-03 |
EP0011013A1 (fr) | 1980-05-14 |
FR2440615A1 (fr) | 1980-05-30 |
DE2962240D1 (en) | 1982-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5691743A (en) | Nonsticky electroconductive film and method | |
JPS5334838A (en) | Coater and method of making the same | |
GB2029613B (en) | Carry anticipator circuit and method | |
JPS5533093A (en) | Thin film magnetic material and method of manufacturing same | |
JPS5565494A (en) | Method of manufacturing precise metallic lug on film support and film support having same lug | |
JPS55103780A (en) | Method of manufacturing piezooelectric film | |
JPS5524499A (en) | Electric film circuit and method of manufacturing same | |
JPS5651805A (en) | Method of forming conductive thin film | |
GB2027637B (en) | Microporous film and method of manufacturing the same | |
JPS55106059A (en) | Spral metallic band and method of manufacturing same | |
JPS55102219A (en) | Method of manufacturing sheathed thin film capacitor and capacitor thereof | |
JPS5632608A (en) | Method of forming conductive film | |
JPS5520994A (en) | Diaphragm and its manufacturing method | |
JPS5334630A (en) | Production method of metallic film | |
JPS52117375A (en) | Contraction film and its method of manufacture | |
JPS5638806A (en) | Method of manufacturing high integrity thin film resistor | |
JPS5510704A (en) | Transparent conductive film and method of manufacturing same | |
JPS54158297A (en) | Alfaaamylase substrate and making method thereof | |
JPS54115063A (en) | Method of forming metal film | |
JPS5564334A (en) | Method of and device for manufacturing cathode | |
JPS5696801A (en) | Film resistor and method of manufacturing same | |
JPS5686407A (en) | Transparent conductive film and method of manufacturing same | |
JPS5573548A (en) | Weatherrproof heattcontractible film and making method thereof | |
JPS5694684A (en) | Thin film fine pattern and method of manufacturing same | |
JPS5628408A (en) | Method of manufacturing ferrodielectric thin film |