JPS5561125A - Packaging method for elastic surface wave element - Google Patents

Packaging method for elastic surface wave element

Info

Publication number
JPS5561125A
JPS5561125A JP13409178A JP13409178A JPS5561125A JP S5561125 A JPS5561125 A JP S5561125A JP 13409178 A JP13409178 A JP 13409178A JP 13409178 A JP13409178 A JP 13409178A JP S5561125 A JPS5561125 A JP S5561125A
Authority
JP
Japan
Prior art keywords
surface wave
wave element
elastic surface
packaging method
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13409178A
Other languages
Japanese (ja)
Inventor
Hitoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13409178A priority Critical patent/JPS5561125A/en
Publication of JPS5561125A publication Critical patent/JPS5561125A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To obtain a highly-reliable package of simple structure by forming a convex part in an insulation substrate at the side of a surface wave propagation surface. CONSTITUTION:An elastic surface wave element is provided with a couple of transducers 12 and a couple of absorbing materials 13. Insulation substrate 14 is provided with concave part 15 corresponding to the surface wave propagation surface of elastic surface wave element 11, in order to reduce attenuation of a surface wave. Elastic surface wave element 11 is fitted woth its face down to improve reliability.
JP13409178A 1978-10-31 1978-10-31 Packaging method for elastic surface wave element Pending JPS5561125A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13409178A JPS5561125A (en) 1978-10-31 1978-10-31 Packaging method for elastic surface wave element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13409178A JPS5561125A (en) 1978-10-31 1978-10-31 Packaging method for elastic surface wave element

Publications (1)

Publication Number Publication Date
JPS5561125A true JPS5561125A (en) 1980-05-08

Family

ID=15120208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13409178A Pending JPS5561125A (en) 1978-10-31 1978-10-31 Packaging method for elastic surface wave element

Country Status (1)

Country Link
JP (1) JPS5561125A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155132U (en) * 1982-04-13 1983-10-17 松下電器産業株式会社 surface wave filter
JPS6297418A (en) * 1985-10-23 1987-05-06 Clarion Co Ltd Packaging method for surface acoustic wave device
JPS62256514A (en) * 1986-04-30 1987-11-09 Matsushita Electric Ind Co Ltd Mounting method for surface acoustic wave device
JPS63115412A (en) * 1986-10-31 1988-05-20 Fujitsu Ltd Packing method for surface acoustic wave element
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155132U (en) * 1982-04-13 1983-10-17 松下電器産業株式会社 surface wave filter
JPS6297418A (en) * 1985-10-23 1987-05-06 Clarion Co Ltd Packaging method for surface acoustic wave device
JPS62256514A (en) * 1986-04-30 1987-11-09 Matsushita Electric Ind Co Ltd Mounting method for surface acoustic wave device
JPS63115412A (en) * 1986-10-31 1988-05-20 Fujitsu Ltd Packing method for surface acoustic wave element
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6628043B2 (en) 1995-06-30 2003-09-30 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6754950B2 (en) 1995-06-30 2004-06-29 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

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