JPS555853B2 - - Google Patents

Info

Publication number
JPS555853B2
JPS555853B2 JP2050975A JP2050975A JPS555853B2 JP S555853 B2 JPS555853 B2 JP S555853B2 JP 2050975 A JP2050975 A JP 2050975A JP 2050975 A JP2050975 A JP 2050975A JP S555853 B2 JPS555853 B2 JP S555853B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2050975A
Other languages
Japanese (ja)
Other versions
JPS5194766A (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2050975A priority Critical patent/JPS555853B2/ja
Priority to US05/658,014 priority patent/US4039114A/en
Priority to GB6159/76A priority patent/GB1524462A/en
Priority to NLAANVRAGE7601636,A priority patent/NL171943C/xx
Publication of JPS5194766A publication Critical patent/JPS5194766A/ja
Publication of JPS555853B2 publication Critical patent/JPS555853B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP2050975A 1975-02-18 1975-02-18 Expired JPS555853B2 (OSRAM)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2050975A JPS555853B2 (OSRAM) 1975-02-18 1975-02-18
US05/658,014 US4039114A (en) 1975-02-18 1976-02-13 Wire-bonding equipment
GB6159/76A GB1524462A (en) 1975-02-18 1976-02-17 Wire bonding apparartus
NLAANVRAGE7601636,A NL171943C (nl) 1975-02-18 1976-02-18 Bedradingsinrichting, voor het aanbrengen van draadverbindingen van micro-electronische elementen.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2050975A JPS555853B2 (OSRAM) 1975-02-18 1975-02-18

Publications (2)

Publication Number Publication Date
JPS5194766A JPS5194766A (OSRAM) 1976-08-19
JPS555853B2 true JPS555853B2 (OSRAM) 1980-02-12

Family

ID=12029120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2050975A Expired JPS555853B2 (OSRAM) 1975-02-18 1975-02-18

Country Status (4)

Country Link
US (1) US4039114A (OSRAM)
JP (1) JPS555853B2 (OSRAM)
GB (1) GB1524462A (OSRAM)
NL (1) NL171943C (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4795518A (en) * 1984-02-17 1989-01-03 Burr-Brown Corporation Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus
US4619395A (en) * 1985-10-04 1986-10-28 Kulicke And Soffa Industries, Inc. Low inertia movable workstation
US4844324A (en) * 1987-09-29 1989-07-04 Todd Thomas W Solder system and method of using same
JPH0235743A (ja) * 1988-07-26 1990-02-06 Mitsubishi Electric Corp 半導体装置の製造装置
DE10133885A1 (de) * 2000-07-21 2002-03-21 Esec Trading Sa Vorrichtung zur Herstellung von Drahtverbindungen
US6808102B1 (en) * 2000-08-28 2004-10-26 Asm Assembly Automation Ltd. Wire-bonding apparatus with improved XY-table orientation
US6837751B2 (en) 2002-07-25 2005-01-04 Delphi Technologies, Inc. Electrical connector incorporating terminals having ultrasonically welded wires
US6588646B2 (en) * 2001-11-24 2003-07-08 Delphi Technologies, Inc. Ultrasonic welding of wires through the insulation jacket thereof
JP2004134578A (ja) * 2002-10-10 2004-04-30 Hamamatsu Photonics Kk 光検出装置及びその製造方法
US20070181645A1 (en) * 2006-01-13 2007-08-09 Ho Wing Cheung J Wire bonding method and apparatus
US7654436B2 (en) * 2007-09-20 2010-02-02 Asm Assembly Automation Ltd. Wire bonding system utilizing multiple positioning tables

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2352113B2 (de) * 1973-10-17 1975-08-14 Eggert 8035 Gauting Herrmann Maschine zum automatischen Befestigen von Verbindungsdrähten an den Anschlußstellen eines Halbleiterkristalls
US3946931A (en) * 1974-11-27 1976-03-30 Western Electric Company, Inc. Methods of and apparatus for bonding an article to a substrate

Also Published As

Publication number Publication date
GB1524462A (en) 1978-09-13
JPS5194766A (OSRAM) 1976-08-19
US4039114A (en) 1977-08-02
NL7601636A (nl) 1976-08-20
NL171943B (nl) 1983-01-03
NL171943C (nl) 1983-06-01

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