JPS5557420A - Method for cutting soft elastic material such as sponge - Google Patents

Method for cutting soft elastic material such as sponge

Info

Publication number
JPS5557420A
JPS5557420A JP13121078A JP13121078A JPS5557420A JP S5557420 A JPS5557420 A JP S5557420A JP 13121078 A JP13121078 A JP 13121078A JP 13121078 A JP13121078 A JP 13121078A JP S5557420 A JPS5557420 A JP S5557420A
Authority
JP
Japan
Prior art keywords
elastic material
water
soft elastic
sponge
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13121078A
Other languages
Japanese (ja)
Inventor
Takemi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP13121078A priority Critical patent/JPS5557420A/en
Publication of JPS5557420A publication Critical patent/JPS5557420A/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Cutting Devices (AREA)
  • Manufacture Of Switches (AREA)

Abstract

PURPOSE: To provide soft elastic material such as sponge having a predetermined uniform thickness by once impregneting the soft material with a substance for promoting cooling and hardening such as water and thereafter cutting the impregrated soft elastic material.
CONSTITUTION: After impregnating a soft elastic material 10 such as sponge with water or the like, the soft material is cooled and hardened. Then, after cutting into a predetermined thickness, the water is removed. For example, in case that movable electrode buffer of keyboard device is made, whole soft elastic material 10 is penetrated with water and therafter cooled to freeze the water in the inside and remove softness. Then after the hardened elastic material 10 is cut into the predetermined thickness, the water is removed and a film of polyester 11 is heat-welded to upper and lower surfaces and a film 12 and conductive film 13 which do not pass through adhesive agent are attached thereon. Then, it is blanked into desired shape and as separating the film 12, can be used as electrode buffer.
COPYRIGHT: (C)1980,JPO&Japio
JP13121078A 1978-10-24 1978-10-24 Method for cutting soft elastic material such as sponge Pending JPS5557420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13121078A JPS5557420A (en) 1978-10-24 1978-10-24 Method for cutting soft elastic material such as sponge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13121078A JPS5557420A (en) 1978-10-24 1978-10-24 Method for cutting soft elastic material such as sponge

Publications (1)

Publication Number Publication Date
JPS5557420A true JPS5557420A (en) 1980-04-28

Family

ID=15052605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13121078A Pending JPS5557420A (en) 1978-10-24 1978-10-24 Method for cutting soft elastic material such as sponge

Country Status (1)

Country Link
JP (1) JPS5557420A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792847A (en) * 1980-11-29 1982-06-09 Nec Home Electronics Ltd Manufacture of semiconductor pellet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792847A (en) * 1980-11-29 1982-06-09 Nec Home Electronics Ltd Manufacture of semiconductor pellet

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