JPS5554342A - Hot-melt composition - Google Patents

Hot-melt composition

Info

Publication number
JPS5554342A
JPS5554342A JP13605879A JP13605879A JPS5554342A JP S5554342 A JPS5554342 A JP S5554342A JP 13605879 A JP13605879 A JP 13605879A JP 13605879 A JP13605879 A JP 13605879A JP S5554342 A JPS5554342 A JP S5554342A
Authority
JP
Japan
Prior art keywords
resin
vinyl acetate
parts
copolymer
cyclopentadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13605879A
Other languages
Japanese (ja)
Inventor
Akira Wada
Nobumitsu Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Nippon Zeon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Zeon Co Ltd filed Critical Nippon Zeon Co Ltd
Priority to JP13605879A priority Critical patent/JPS5554342A/en
Publication of JPS5554342A publication Critical patent/JPS5554342A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: The title composition having the adhesiveness equal to or better than the rosin resin, comprising an ethlene copolymer and an unhydrogenated cyclopentadiene resin.
CONSTITUTION: A composition prepared by kneding (A) 100 parts by wt. of an ethylene copolymer, particularly ethylene-vinyl acetate copolymer with a vinyl acetate content of 5W60wt% and a melt index of 0.5W450 for industrial use, with (B) 5W300 parts by wt., preferably 50W200 parts by wt., of an unhydrogented cyclopentadiene resin having a softening point of 50W170°C, preferably 70W150°C., at 100W 200°C. The resin (B) is obtained by thermal polymerization of (a) 90W40 wt% (except 88.5wt%), preferably 80W50wt%, of a cyclopentadiene monomer, with (b) 10W60wt% (except 11.5wt%), preferably 20W50wt%, of vinyl acetate in an inert gas at 200W300°C for 0.5W20 hr.
COPYRIGHT: (C)1980,JPO&Japio
JP13605879A 1979-10-22 1979-10-22 Hot-melt composition Pending JPS5554342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13605879A JPS5554342A (en) 1979-10-22 1979-10-22 Hot-melt composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13605879A JPS5554342A (en) 1979-10-22 1979-10-22 Hot-melt composition

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3960974A Division JPS5546426B2 (en) 1974-04-08 1974-04-08

Publications (1)

Publication Number Publication Date
JPS5554342A true JPS5554342A (en) 1980-04-21

Family

ID=15166201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13605879A Pending JPS5554342A (en) 1979-10-22 1979-10-22 Hot-melt composition

Country Status (1)

Country Link
JP (1) JPS5554342A (en)

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