JPS5550494A - Method and apparatus for arraying partially plated materials - Google Patents

Method and apparatus for arraying partially plated materials

Info

Publication number
JPS5550494A
JPS5550494A JP12354278A JP12354278A JPS5550494A JP S5550494 A JPS5550494 A JP S5550494A JP 12354278 A JP12354278 A JP 12354278A JP 12354278 A JP12354278 A JP 12354278A JP S5550494 A JPS5550494 A JP S5550494A
Authority
JP
Japan
Prior art keywords
partially plated
arraying
materials
rail
secured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12354278A
Other languages
Japanese (ja)
Inventor
Tetsuo Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Giken Kogyo KK
Original Assignee
Toyo Giken Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Giken Kogyo KK filed Critical Toyo Giken Kogyo KK
Priority to JP12354278A priority Critical patent/JPS5550494A/en
Publication of JPS5550494A publication Critical patent/JPS5550494A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To automate arraying of partially plated materials and increase the productivity, by disposing an apparatus for automatically feeding the materials to be partially plated having guide holes engaging with pins, in a packing feeding apparatus provided with pins arrayed and secured at specified pitches.
CONSTITUTION: A partially plated material 1 held on a rack 24 is attracted by a vacuum head 16, and is lowered by means of air cylinder 21 and guide groove 20. Stopping the vacuum pump, the material 1 is dropped into a holding device consisting of chute 7, holding plate 9, and rail 8. This timing is controlled by a switching device 28 on the moment when one end of a previous material 1 contacts with a pin 5 secured at specified pitch to a packing or a masking material 4 placed on a truck 6 moving horizontally and the other end is released from the rail 8. The pin 5 fits into a guide hole 2, so that the material 1 may be automatically arrayed.
COPYRIGHT: (C)1980,JPO&Japio
JP12354278A 1978-10-09 1978-10-09 Method and apparatus for arraying partially plated materials Pending JPS5550494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12354278A JPS5550494A (en) 1978-10-09 1978-10-09 Method and apparatus for arraying partially plated materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12354278A JPS5550494A (en) 1978-10-09 1978-10-09 Method and apparatus for arraying partially plated materials

Publications (1)

Publication Number Publication Date
JPS5550494A true JPS5550494A (en) 1980-04-12

Family

ID=14863168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12354278A Pending JPS5550494A (en) 1978-10-09 1978-10-09 Method and apparatus for arraying partially plated materials

Country Status (1)

Country Link
JP (1) JPS5550494A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58144499A (en) * 1982-02-19 1983-08-27 C Uyemura & Co Ltd Apparatus for mounting work for plating treatment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58144499A (en) * 1982-02-19 1983-08-27 C Uyemura & Co Ltd Apparatus for mounting work for plating treatment
JPH0251998B2 (en) * 1982-02-19 1990-11-09 Uemura Kogyo Kk

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