JPS5550483A - High stress nickel plating bath - Google Patents
High stress nickel plating bathInfo
- Publication number
- JPS5550483A JPS5550483A JP12285878A JP12285878A JPS5550483A JP S5550483 A JPS5550483 A JP S5550483A JP 12285878 A JP12285878 A JP 12285878A JP 12285878 A JP12285878 A JP 12285878A JP S5550483 A JPS5550483 A JP S5550483A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- high stress
- plating bath
- nickel plating
- chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To enable the plating film of high corrosiveness to be formed over a high (low) current density renge by adding the limited amounts of chloride of alkaline eath metals to the bath containing the respectively specified amounts of NiCl2. 6H2O and H3BO3.
CONSTITUTION: Chloride of alkaline earth metals (e.g., BaCl2) is added at 5W 200g/l(10W100g/l) to the bath containing NiCl2.6H2O 70W400g/l(preferably 150W300g/l) and N3BO3 at 3g/l or over (7W30g/l). Or further NH4Cl is added at 50g/l or under. The resultant high stress Ni plating bath is used for micro-crack Cr plating process to form numerous micro-cracks in the Cr plating film thereby increasing the corrosion resistance of the plating.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12285878A JPS5830959B2 (en) | 1978-10-05 | 1978-10-05 | High stress nickel plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12285878A JPS5830959B2 (en) | 1978-10-05 | 1978-10-05 | High stress nickel plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5550483A true JPS5550483A (en) | 1980-04-12 |
JPS5830959B2 JPS5830959B2 (en) | 1983-07-02 |
Family
ID=14846376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12285878A Expired JPS5830959B2 (en) | 1978-10-05 | 1978-10-05 | High stress nickel plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5830959B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010007172A (en) * | 2008-06-30 | 2010-01-14 | Tdk Corp | Nickel electroplating liquid and plating method |
JP4906957B1 (en) * | 2010-12-07 | 2012-03-28 | 日本特殊陶業株式会社 | Spark plug |
JP2012077324A (en) * | 2010-09-30 | 2012-04-19 | Tdk Corp | Nickel plating liquid |
-
1978
- 1978-10-05 JP JP12285878A patent/JPS5830959B2/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010007172A (en) * | 2008-06-30 | 2010-01-14 | Tdk Corp | Nickel electroplating liquid and plating method |
JP2012077324A (en) * | 2010-09-30 | 2012-04-19 | Tdk Corp | Nickel plating liquid |
JP4906957B1 (en) * | 2010-12-07 | 2012-03-28 | 日本特殊陶業株式会社 | Spark plug |
WO2012077260A1 (en) * | 2010-12-07 | 2012-06-14 | 日本特殊陶業株式会社 | Spark plug |
JP2012123954A (en) * | 2010-12-07 | 2012-06-28 | Ngk Spark Plug Co Ltd | Spark plug |
CN103250310A (en) * | 2010-12-07 | 2013-08-14 | 日本特殊陶业株式会社 | Spark plug |
EP2650986A1 (en) * | 2010-12-07 | 2013-10-16 | Ngk Spark Plug Co., Ltd. | Spark plug |
EP2650986A4 (en) * | 2010-12-07 | 2014-12-24 | Ngk Spark Plug Co | Spark plug |
US9130355B2 (en) | 2010-12-07 | 2015-09-08 | Ngk Spark Plug Co., Ltd. | Spark plug |
Also Published As
Publication number | Publication date |
---|---|
JPS5830959B2 (en) | 1983-07-02 |
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