JPS5548946A - Supersonic wire bonding - Google Patents

Supersonic wire bonding

Info

Publication number
JPS5548946A
JPS5548946A JP12118278A JP12118278A JPS5548946A JP S5548946 A JPS5548946 A JP S5548946A JP 12118278 A JP12118278 A JP 12118278A JP 12118278 A JP12118278 A JP 12118278A JP S5548946 A JPS5548946 A JP S5548946A
Authority
JP
Japan
Prior art keywords
supersonic
wire
waveform
bonding
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12118278A
Other languages
Japanese (ja)
Inventor
Kenji Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12118278A priority Critical patent/JPS5548946A/en
Publication of JPS5548946A publication Critical patent/JPS5548946A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve bonding efficiency, by inserting a waveform detector element into a transmitter side input terminal of a supersonic wedge, and detecting a wire cut by the waveform detected at the time of bonding. CONSTITUTION:By using support 1, supersonic horn 3 screwed with a supersonic wedge 6 on its end is supported on one side, and oscillator 2 is supported on the other side. Next, oscillator 2 is connected with transmitter 4, and synchroscope 5 is connected to the wiring connecting these elements. When supersonic wire bonding is operated under this structure, the monitor waveform appearing on synchroscope 5 differs between a normal and an abnormal case. Hence, this is converted into a binary digital waveform, and by observing this, a wire cut is ascertained. In this way, a wire-cut detector device is fitted to a bonder device itself.
JP12118278A 1978-10-03 1978-10-03 Supersonic wire bonding Pending JPS5548946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12118278A JPS5548946A (en) 1978-10-03 1978-10-03 Supersonic wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12118278A JPS5548946A (en) 1978-10-03 1978-10-03 Supersonic wire bonding

Publications (1)

Publication Number Publication Date
JPS5548946A true JPS5548946A (en) 1980-04-08

Family

ID=14804872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12118278A Pending JPS5548946A (en) 1978-10-03 1978-10-03 Supersonic wire bonding

Country Status (1)

Country Link
JP (1) JPS5548946A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
US5931367A (en) * 1996-08-08 1999-08-03 Ultex Corporation Removable bonding working portions for an ultrasonic welder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
US5931367A (en) * 1996-08-08 1999-08-03 Ultex Corporation Removable bonding working portions for an ultrasonic welder

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