JPS5546594A - Monolithic integrated circuit with high dielectric strength - Google Patents

Monolithic integrated circuit with high dielectric strength

Info

Publication number
JPS5546594A
JPS5546594A JP12469279A JP12469279A JPS5546594A JP S5546594 A JPS5546594 A JP S5546594A JP 12469279 A JP12469279 A JP 12469279A JP 12469279 A JP12469279 A JP 12469279A JP S5546594 A JPS5546594 A JP S5546594A
Authority
JP
Japan
Prior art keywords
integrated circuit
high dielectric
dielectric strength
monolithic integrated
monolithic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12469279A
Other languages
English (en)
Inventor
Miyuraa Riyudeigaa
Pomupaa Mihiaeru
Raiporuto Ruudouitsuhi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5546594A publication Critical patent/JPS5546594A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/13—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body combined with thin-film or thick-film passive components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S331/00—Oscillators
    • Y10S331/03—Logic gate active element oscillator

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
JP12469279A 1978-09-28 1979-09-27 Monolithic integrated circuit with high dielectric strength Pending JPS5546594A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782842319 DE2842319A1 (de) 1978-09-28 1978-09-28 Monolithisch integrierte schaltung mit hoher spannungsfestigkeit zur koppelung galvanisch getrennter schaltkreise

Publications (1)

Publication Number Publication Date
JPS5546594A true JPS5546594A (en) 1980-04-01

Family

ID=6050752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12469279A Pending JPS5546594A (en) 1978-09-28 1979-09-27 Monolithic integrated circuit with high dielectric strength

Country Status (6)

Country Link
US (1) US4339668A (ja)
JP (1) JPS5546594A (ja)
CA (1) CA1133148A (ja)
DE (1) DE2842319A1 (ja)
FR (1) FR2437698A1 (ja)
GB (1) GB2035702B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998044687A1 (fr) * 1997-03-31 1998-10-08 Hitachi, Ltd. Modem utilisant une barriere isolante capacitive et un coupleur insolant, et circuit integre utilise par ce modem
US7289553B2 (en) 1998-02-27 2007-10-30 Hitachi, Ltd. Isolator and a modem device using the isolator
JP2010016815A (ja) * 2008-06-27 2010-01-21 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 容量性信号結合を用いた高電圧駆動回路及び関連する装置及び方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4853523A (en) * 1987-10-05 1989-08-01 Pitney Bowes Inc. Vault cartridge having capacitive coupling
US4802027A (en) * 1987-10-05 1989-01-31 Pitney Bowes Inc. Data storage device coupled to a data storage interface
CA1294333C (fr) * 1987-10-12 1992-01-14 Marie-Christine Rolland Systeme anti-vol de recepteur radio utilise notamment dans un vehicule automobile
JPH0563615A (ja) * 1991-08-30 1993-03-12 Ncr Corp 容量結合装置
US6728113B1 (en) 1993-06-24 2004-04-27 Polychip, Inc. Method and apparatus for non-conductively interconnecting integrated circuits
US6023202A (en) * 1998-02-13 2000-02-08 Hewlett-Packard Company Ground return for high speed digital signals that are capacitively coupled across a DC-isolated interface
US7356952B2 (en) * 2002-06-17 2008-04-15 Philip Morris Usa Inc. System for coupling package displays to remote power source
US7170927B2 (en) * 2002-08-16 2007-01-30 Texas Instruments Incorporated Methods and apparatus for an ADSL transceiver
JP2006121046A (ja) * 2004-09-24 2006-05-11 Meiko:Kk 回路基板
US7425760B1 (en) 2004-10-13 2008-09-16 Sun Microsystems, Inc. Multi-chip module structure with power delivery using flexible cables
US8624740B2 (en) * 2005-02-04 2014-01-07 Philip Morris Usa Inc. Controllable RFID card
US7429984B2 (en) * 2005-02-04 2008-09-30 Philip Morris Usa Inc. Display management system
US7504905B1 (en) 2008-01-30 2009-03-17 The United States Of America As Represented By The Secretary Of The Navy Method for coupling a direct current power source across a dielectric membrane or other non-conducting membrane
WO2012065229A1 (en) 2010-11-18 2012-05-24 The Silanna Group Pty Ltd Single-chip integrated circuit with capacitive isolation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042948A (en) * 1959-05-06 1977-08-16 Texas Instruments Incorporated Integrated circuit isolation with mesas and/or insulating substrate
US3519901A (en) * 1968-01-29 1970-07-07 Texas Instruments Inc Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation
US4024626A (en) * 1974-12-09 1977-05-24 Hughes Aircraft Company Method of making integrated transistor matrix for flat panel liquid crystal display
GB1537843A (en) * 1975-11-17 1979-01-04 Nat Res Dev Charge-coupled devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998044687A1 (fr) * 1997-03-31 1998-10-08 Hitachi, Ltd. Modem utilisant une barriere isolante capacitive et un coupleur insolant, et circuit integre utilise par ce modem
US7289553B2 (en) 1998-02-27 2007-10-30 Hitachi, Ltd. Isolator and a modem device using the isolator
US7522692B2 (en) 1998-02-27 2009-04-21 Hitachi, Ltd. Isolator and a modem device using the isolator
JP2010016815A (ja) * 2008-06-27 2010-01-21 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 容量性信号結合を用いた高電圧駆動回路及び関連する装置及び方法

Also Published As

Publication number Publication date
FR2437698B1 (ja) 1984-08-10
DE2842319A1 (de) 1980-04-17
FR2437698A1 (fr) 1980-04-25
GB2035702A (en) 1980-06-18
GB2035702B (en) 1983-03-02
CA1133148A (en) 1982-10-05
US4339668A (en) 1982-07-13

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