JPS553811B1 - - Google Patents
Info
- Publication number
- JPS553811B1 JPS553811B1 JP9352871A JP9352871A JPS553811B1 JP S553811 B1 JPS553811 B1 JP S553811B1 JP 9352871 A JP9352871 A JP 9352871A JP 9352871 A JP9352871 A JP 9352871A JP S553811 B1 JPS553811 B1 JP S553811B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/466—Tape carriers or flat leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2057126A DE2057126C3 (de) | 1970-05-14 | 1970-11-20 | Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS553811B1 true JPS553811B1 (en:Method) | 1980-01-26 |
Family
ID=5788681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9352871A Pending JPS553811B1 (en:Method) | 1970-11-20 | 1971-11-20 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS553811B1 (en:Method) |
| AT (1) | AT333344B (en:Method) |
| CA (1) | CA981807A (en:Method) |
| CH (1) | CH534428A (en:Method) |
| GB (1) | GB1325393A (en:Method) |
| IT (1) | IT972047B (en:Method) |
| SE (1) | SE378707B (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2167228B (en) * | 1984-10-11 | 1988-05-05 | Anamartic Ltd | Integrated circuit package |
-
1971
- 1971-09-03 CH CH1291171A patent/CH534428A/de not_active IP Right Cessation
- 1971-09-30 AT AT846671A patent/AT333344B/de not_active IP Right Cessation
- 1971-11-03 GB GB5101071A patent/GB1325393A/en not_active Expired
- 1971-11-04 SE SE7114115A patent/SE378707B/xx unknown
- 1971-11-19 CA CA128,073A patent/CA981807A/en not_active Expired
- 1971-11-19 IT IT31361/71A patent/IT972047B/it active
- 1971-11-20 JP JP9352871A patent/JPS553811B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT972047B (it) | 1974-05-20 |
| GB1325393A (en) | 1973-08-01 |
| AT333344B (de) | 1976-11-10 |
| ATA846671A (de) | 1976-03-15 |
| CH534428A (de) | 1973-02-28 |
| CA981807A (en) | 1976-01-13 |
| SE378707B (en:Method) | 1975-09-08 |