JPS5537334A - Apparatus for and method of expansion forming - Google Patents

Apparatus for and method of expansion forming

Info

Publication number
JPS5537334A
JPS5537334A JP11035378A JP11035378A JPS5537334A JP S5537334 A JPS5537334 A JP S5537334A JP 11035378 A JP11035378 A JP 11035378A JP 11035378 A JP11035378 A JP 11035378A JP S5537334 A JPS5537334 A JP S5537334A
Authority
JP
Japan
Prior art keywords
mold
metal mold
foaming resin
base
formed piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11035378A
Other languages
Japanese (ja)
Other versions
JPS5947975B2 (en
Inventor
Takashi Kamimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Kasei Co Ltd
Original Assignee
Sekisui Plastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Plastics Co Ltd filed Critical Sekisui Plastics Co Ltd
Priority to JP53110353A priority Critical patent/JPS5947975B2/en
Publication of JPS5537334A publication Critical patent/JPS5537334A/en
Publication of JPS5947975B2 publication Critical patent/JPS5947975B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To obtain automatically the expansion formed product with high integrality by adsorbing the proper number of non-foaming resin formed pieces on one forming mold, filling the foaming resin powder in the mold cavity between each formed piece and the other mold and then expanding it with heat.
CONSTITUTION: A base 30 of a feeding mechanism C is pivoted to a supplying portion 35 for a non-foaming resin formed piece A. At this positon, the formed piece A is taken out thereon by adsorbing and then a pivoting arm 34 is pivoted and lowered to the position where the base 30 opposes to a core metal mold 10 by means of a cylinder 36. The formed piece A is then attracted on the core metal mold 10 through the absorption action thereof after releasing the absorption by the base 30. Next, a cavity metal mold 20 is moved to effect the mold clamp towards the core metal mold 10. Afterwards, foaming thermo-plastic resin particles are filled in a mold cavity 50 and air is released. Then, the particles are expanded through the supply of steam. At this time, the non-foaming resin formed piece A is welded to a expansion formed portion B to be formed integrally. Finally, after being cooled with cooling water, thus obtained formed product is removed out from the molds.
COPYRIGHT: (C)1980,JPO&Japio
JP53110353A 1978-09-07 1978-09-07 Foam molding equipment Expired JPS5947975B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53110353A JPS5947975B2 (en) 1978-09-07 1978-09-07 Foam molding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53110353A JPS5947975B2 (en) 1978-09-07 1978-09-07 Foam molding equipment

Publications (2)

Publication Number Publication Date
JPS5537334A true JPS5537334A (en) 1980-03-15
JPS5947975B2 JPS5947975B2 (en) 1984-11-22

Family

ID=14533606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53110353A Expired JPS5947975B2 (en) 1978-09-07 1978-09-07 Foam molding equipment

Country Status (1)

Country Link
JP (1) JPS5947975B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108372300A (en) * 2017-01-04 2018-08-07 中国航空制造技术研究院 A kind of laser or electron beam selective melting subregion power spreading device and its method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6340730B2 (en) * 2014-12-01 2018-06-13 平岡 重道 Method for producing thermoplastic resin molded article
CN110948877B (en) * 2019-12-24 2021-06-08 安徽中健三维科技有限公司 Cooling device applied to LCD3D printer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108372300A (en) * 2017-01-04 2018-08-07 中国航空制造技术研究院 A kind of laser or electron beam selective melting subregion power spreading device and its method

Also Published As

Publication number Publication date
JPS5947975B2 (en) 1984-11-22

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