JPS553678A - Preparation of lead frame - Google Patents

Preparation of lead frame

Info

Publication number
JPS553678A
JPS553678A JP7629078A JP7629078A JPS553678A JP S553678 A JPS553678 A JP S553678A JP 7629078 A JP7629078 A JP 7629078A JP 7629078 A JP7629078 A JP 7629078A JP S553678 A JPS553678 A JP S553678A
Authority
JP
Japan
Prior art keywords
base material
alloy
metal
lead frame
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7629078A
Other languages
Japanese (ja)
Inventor
Yoshio Shinoda
Tomoyuki Furuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP7629078A priority Critical patent/JPS553678A/en
Publication of JPS553678A publication Critical patent/JPS553678A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a lead frame, by changing a surface-layer metallic material into an inky condition, by producing a surface-layer metallic layer by means of printing and by sintering the layer. CONSTITUTION:The powder (The diameters of powder are approximate 0.1- 1mum) of a metallic material, which melting point is lower than base material metal and which soldering capacity is better than the base material metal, such as, an Ag-Cu alloy, etc. is changed into an inky condition with an organic solvent and a binder, and printed on a base material in an alloy containing Ni, such as, a Fe-Ni alloy, a Fe-Ni-Co alloy, etc. The base material is dried at approximate 80-180 deg.C to evaporate the organic solvent, and sintered not less than the eutectic temperature of surface metal and not more than the melting point of the base material metal in hydrogen or rare gases. When the Ag-Cu alloy is printed on the Fe-Ni base material, the conditions of 850-900 deg.C and 15-30 minutes are better. If this lead frame is produced in this manner, a precious metal pattern with the high degree of freedom can be obtained, the process of work is also short and expensive devices are also unnecessary.
JP7629078A 1978-06-23 1978-06-23 Preparation of lead frame Pending JPS553678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7629078A JPS553678A (en) 1978-06-23 1978-06-23 Preparation of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7629078A JPS553678A (en) 1978-06-23 1978-06-23 Preparation of lead frame

Publications (1)

Publication Number Publication Date
JPS553678A true JPS553678A (en) 1980-01-11

Family

ID=13601190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7629078A Pending JPS553678A (en) 1978-06-23 1978-06-23 Preparation of lead frame

Country Status (1)

Country Link
JP (1) JPS553678A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869293U (en) * 1981-11-05 1983-05-11 株式会社精工舎 clock
JPS6321862A (en) * 1986-07-15 1988-01-29 Kyocera Corp Manufacture of lead frame for ic ceramic package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869293U (en) * 1981-11-05 1983-05-11 株式会社精工舎 clock
JPS6321862A (en) * 1986-07-15 1988-01-29 Kyocera Corp Manufacture of lead frame for ic ceramic package

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