JPS5536184B2 - - Google Patents

Info

Publication number
JPS5536184B2
JPS5536184B2 JP3843175A JP3843175A JPS5536184B2 JP S5536184 B2 JPS5536184 B2 JP S5536184B2 JP 3843175 A JP3843175 A JP 3843175A JP 3843175 A JP3843175 A JP 3843175A JP S5536184 B2 JPS5536184 B2 JP S5536184B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3843175A
Other languages
Japanese (ja)
Other versions
JPS51113459A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3843175A priority Critical patent/JPS51113459A/ja
Publication of JPS51113459A publication Critical patent/JPS51113459A/ja
Publication of JPS5536184B2 publication Critical patent/JPS5536184B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP3843175A 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices Granted JPS51113459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3843175A JPS51113459A (en) 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3843175A JPS51113459A (en) 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices

Publications (2)

Publication Number Publication Date
JPS51113459A JPS51113459A (en) 1976-10-06
JPS5536184B2 true JPS5536184B2 (cs) 1980-09-19

Family

ID=12525106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3843175A Granted JPS51113459A (en) 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices

Country Status (1)

Country Link
JP (1) JPS51113459A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524780A (en) * 1975-07-01 1977-01-14 Fujitsu Ltd Manufacturing method of semiconductor equipment

Also Published As

Publication number Publication date
JPS51113459A (en) 1976-10-06

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