JPS5524704B2 - - Google Patents

Info

Publication number
JPS5524704B2
JPS5524704B2 JP14908574A JP14908574A JPS5524704B2 JP S5524704 B2 JPS5524704 B2 JP S5524704B2 JP 14908574 A JP14908574 A JP 14908574A JP 14908574 A JP14908574 A JP 14908574A JP S5524704 B2 JPS5524704 B2 JP S5524704B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14908574A
Other languages
Japanese (ja)
Other versions
JPS50102273A (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50102273A publication Critical patent/JPS50102273A/ja
Publication of JPS5524704B2 publication Critical patent/JPS5524704B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/84—Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/018—Compensation doping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/053—Field effect transistors fets

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
JP14908574A 1974-01-02 1974-12-27 Expired JPS5524704B2 (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US430025A US3868274A (en) 1974-01-02 1974-01-02 Method for fabricating MOS devices with a multiplicity of thresholds on a semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS50102273A JPS50102273A (OSRAM) 1975-08-13
JPS5524704B2 true JPS5524704B2 (OSRAM) 1980-07-01

Family

ID=23705767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14908574A Expired JPS5524704B2 (OSRAM) 1974-01-02 1974-12-27

Country Status (5)

Country Link
US (1) US3868274A (OSRAM)
JP (1) JPS5524704B2 (OSRAM)
CA (1) CA1011005A (OSRAM)
DE (1) DE2500047A1 (OSRAM)
GB (1) GB1489390A (OSRAM)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3912545A (en) * 1974-05-13 1975-10-14 Motorola Inc Process and product for making a single supply N-channel silicon gate device
US4115796A (en) * 1974-07-05 1978-09-19 Sharp Kabushiki Kaisha Complementary-MOS integrated semiconductor device
US3975648A (en) * 1975-06-16 1976-08-17 Hewlett-Packard Company Flat-band voltage reference
JPS5226177A (en) * 1975-08-25 1977-02-26 Toshiba Corp Semi-conductor unit
US4052229A (en) * 1976-06-25 1977-10-04 Intel Corporation Process for preparing a substrate for mos devices of different thresholds
US4021270A (en) * 1976-06-28 1977-05-03 Motorola, Inc. Double master mask process for integrated circuit manufacture
US5168075A (en) * 1976-09-13 1992-12-01 Texas Instruments Incorporated Random access memory cell with implanted capacitor region
US5434438A (en) * 1976-09-13 1995-07-18 Texas Instruments Inc. Random access memory cell with a capacitor
JPS544086A (en) * 1977-06-10 1979-01-12 Fujitsu Ltd Memory circuit unit
JPS5413779A (en) * 1977-07-04 1979-02-01 Toshiba Corp Semiconductor integrated circuit device
US4135102A (en) * 1977-07-18 1979-01-16 Mostek Corporation High performance inverter circuits
US4472871A (en) * 1978-09-21 1984-09-25 Mostek Corporation Method of making a plurality of MOSFETs having different threshold voltages
US4212684A (en) * 1978-11-20 1980-07-15 Ncr Corporation CISFET Processing including simultaneous doping of silicon components and FET channels
US4244752A (en) * 1979-03-06 1981-01-13 Burroughs Corporation Single mask method of fabricating complementary integrated circuits
US4218267A (en) * 1979-04-23 1980-08-19 Rockwell International Corporation Microelectronic fabrication method minimizing threshold voltage variation
CA1151295A (en) * 1979-07-31 1983-08-02 Alan Aitken Dual resistivity mos devices and method of fabrication
US4435896A (en) 1981-12-07 1984-03-13 Bell Telephone Laboratories, Incorporated Method for fabricating complementary field effect transistor devices
NL8303441A (nl) * 1983-10-07 1985-05-01 Philips Nv Geintegreerde schakeling met komplementaire veldeffekttransistors.
US4618815A (en) * 1985-02-11 1986-10-21 At&T Bell Laboratories Mixed threshold current mirror
JPH0766946B2 (ja) * 1989-03-31 1995-07-19 株式会社東芝 半導体装置及びその製造方法
US5675165A (en) * 1994-08-02 1997-10-07 Lien; Chuen-Der Stable SRAM cell using low backgate biased threshold voltage select transistors
JP3185862B2 (ja) * 1997-09-10 2001-07-11 日本電気株式会社 マスク型半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2787564A (en) * 1954-10-28 1957-04-02 Bell Telephone Labor Inc Forming semiconductive devices by ionic bombardment
US3575745A (en) * 1969-04-02 1971-04-20 Bryan H Hill Integrated circuit fabrication
US3793093A (en) * 1973-01-12 1974-02-19 Handotai Kenkyu Shinkokai Method for producing a semiconductor device having a very small deviation in lattice constant
US3873372A (en) * 1973-07-09 1975-03-25 Ibm Method for producing improved transistor devices

Also Published As

Publication number Publication date
US3868274A (en) 1975-02-25
DE2500047A1 (de) 1975-07-10
CA1011005A (en) 1977-05-24
JPS50102273A (OSRAM) 1975-08-13
US3868274B1 (OSRAM) 1988-07-26
GB1489390A (en) 1977-10-19

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