JPS5523460B2 - - Google Patents

Info

Publication number
JPS5523460B2
JPS5523460B2 JP3697275A JP3697275A JPS5523460B2 JP S5523460 B2 JPS5523460 B2 JP S5523460B2 JP 3697275 A JP3697275 A JP 3697275A JP 3697275 A JP3697275 A JP 3697275A JP S5523460 B2 JPS5523460 B2 JP S5523460B2
Authority
JP
Japan
Prior art keywords
pellet
semiconductor pellet
comitted
impressed
disturbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3697275A
Other languages
English (en)
Japanese (ja)
Other versions
JPS51113463A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3697275A priority Critical patent/JPS51113463A/ja
Publication of JPS51113463A publication Critical patent/JPS51113463A/ja
Publication of JPS5523460B2 publication Critical patent/JPS5523460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Die Bonding (AREA)
JP3697275A 1975-03-28 1975-03-28 Supporting system of semiconductor pellet Granted JPS51113463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3697275A JPS51113463A (en) 1975-03-28 1975-03-28 Supporting system of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3697275A JPS51113463A (en) 1975-03-28 1975-03-28 Supporting system of semiconductor pellet

Publications (2)

Publication Number Publication Date
JPS51113463A JPS51113463A (en) 1976-10-06
JPS5523460B2 true JPS5523460B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-06-23

Family

ID=12484650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3697275A Granted JPS51113463A (en) 1975-03-28 1975-03-28 Supporting system of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS51113463A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS51113463A (en) 1976-10-06

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