JPS5521342Y2 - - Google Patents
Info
- Publication number
- JPS5521342Y2 JPS5521342Y2 JP1975132305U JP13230575U JPS5521342Y2 JP S5521342 Y2 JPS5521342 Y2 JP S5521342Y2 JP 1975132305 U JP1975132305 U JP 1975132305U JP 13230575 U JP13230575 U JP 13230575U JP S5521342 Y2 JPS5521342 Y2 JP S5521342Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975132305U JPS5521342Y2 (https=) | 1975-09-27 | 1975-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975132305U JPS5521342Y2 (https=) | 1975-09-27 | 1975-09-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5245368U JPS5245368U (https=) | 1977-03-31 |
| JPS5521342Y2 true JPS5521342Y2 (https=) | 1980-05-22 |
Family
ID=28612417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975132305U Expired JPS5521342Y2 (https=) | 1975-09-27 | 1975-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5521342Y2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842405Y2 (ja) * | 1976-09-29 | 1983-09-26 | 昌己 笠置 | ベルトレススラツクス |
| JPS58101443A (ja) * | 1981-12-11 | 1983-06-16 | Hitachi Ltd | 樹脂封止型半導体装置 |
| JP5251991B2 (ja) * | 2011-01-14 | 2013-07-31 | トヨタ自動車株式会社 | 半導体モジュール |
-
1975
- 1975-09-27 JP JP1975132305U patent/JPS5521342Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5245368U (https=) | 1977-03-31 |