JPS552107U - - Google Patents
Info
- Publication number
- JPS552107U JPS552107U JP1978082815U JP8281578U JPS552107U JP S552107 U JPS552107 U JP S552107U JP 1978082815 U JP1978082815 U JP 1978082815U JP 8281578 U JP8281578 U JP 8281578U JP S552107 U JPS552107 U JP S552107U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978082815U JPS5746614Y2 (ja) | 1978-06-15 | 1978-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978082815U JPS5746614Y2 (ja) | 1978-06-15 | 1978-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS552107U true JPS552107U (ja) | 1980-01-09 |
| JPS5746614Y2 JPS5746614Y2 (ja) | 1982-10-14 |
Family
ID=29004019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978082815U Expired JPS5746614Y2 (ja) | 1978-06-15 | 1978-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5746614Y2 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6135939U (ja) * | 1984-08-07 | 1986-03-05 | 小松造機株式会社 | 振動ロ−ラ用鉄輪 |
| JPH0243749A (ja) * | 1988-08-04 | 1990-02-14 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| JPH0382047A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | フィルムキャリヤ半導体装置 |
-
1978
- 1978-06-15 JP JP1978082815U patent/JPS5746614Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6135939U (ja) * | 1984-08-07 | 1986-03-05 | 小松造機株式会社 | 振動ロ−ラ用鉄輪 |
| JPH0243749A (ja) * | 1988-08-04 | 1990-02-14 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| JPH0382047A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | フィルムキャリヤ半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5746614Y2 (ja) | 1982-10-14 |