JPS5519823A - Semoconductor element mounting device - Google Patents
Semoconductor element mounting deviceInfo
- Publication number
- JPS5519823A JPS5519823A JP9212778A JP9212778A JPS5519823A JP S5519823 A JPS5519823 A JP S5519823A JP 9212778 A JP9212778 A JP 9212778A JP 9212778 A JP9212778 A JP 9212778A JP S5519823 A JPS5519823 A JP S5519823A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- attachment
- temperature
- collet
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9212778A JPS5519823A (en) | 1978-07-27 | 1978-07-27 | Semoconductor element mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9212778A JPS5519823A (en) | 1978-07-27 | 1978-07-27 | Semoconductor element mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5519823A true JPS5519823A (en) | 1980-02-12 |
Family
ID=14045760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9212778A Pending JPS5519823A (en) | 1978-07-27 | 1978-07-27 | Semoconductor element mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5519823A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20090581A1 (it) * | 2009-07-29 | 2011-01-30 | Osai A S S R L | Metodo e dispositivo di condizionamento in temperatura di un elemento |
JP4741655B2 (ja) * | 2005-04-08 | 2011-08-03 | フェデラル−モーグル コーポレイション | 金属割軸受圧縮荷重ボールジョイント |
CN104681468A (zh) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | 一种rfid电子标签倒封装热压装置 |
-
1978
- 1978-07-27 JP JP9212778A patent/JPS5519823A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4741655B2 (ja) * | 2005-04-08 | 2011-08-03 | フェデラル−モーグル コーポレイション | 金属割軸受圧縮荷重ボールジョイント |
ITTO20090581A1 (it) * | 2009-07-29 | 2011-01-30 | Osai A S S R L | Metodo e dispositivo di condizionamento in temperatura di un elemento |
WO2011012976A1 (en) * | 2009-07-29 | 2011-02-03 | Osai A.S. S.R.L. | Method and device for temperature conditioning of an element |
CN104681468A (zh) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | 一种rfid电子标签倒封装热压装置 |
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