JPS55175249U - - Google Patents

Info

Publication number
JPS55175249U
JPS55175249U JP7566479U JP7566479U JPS55175249U JP S55175249 U JPS55175249 U JP S55175249U JP 7566479 U JP7566479 U JP 7566479U JP 7566479 U JP7566479 U JP 7566479U JP S55175249 U JPS55175249 U JP S55175249U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7566479U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7566479U priority Critical patent/JPS55175249U/ja
Publication of JPS55175249U publication Critical patent/JPS55175249U/ja
Pending legal-status Critical Current

Links

JP7566479U 1979-06-04 1979-06-04 Pending JPS55175249U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7566479U JPS55175249U (zh) 1979-06-04 1979-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7566479U JPS55175249U (zh) 1979-06-04 1979-06-04

Publications (1)

Publication Number Publication Date
JPS55175249U true JPS55175249U (zh) 1980-12-16

Family

ID=29309192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7566479U Pending JPS55175249U (zh) 1979-06-04 1979-06-04

Country Status (1)

Country Link
JP (1) JPS55175249U (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08306855A (ja) * 1995-04-27 1996-11-22 Lg Semicon Co Ltd 半導体パッケージ、リードフレーム、回路基板、半導体パッケージモールディング用金型及び電子回路盤並にリードフレームの製造方法
WO2007058073A1 (ja) * 2005-11-16 2007-05-24 Sharp Kabushiki Kaisha 半導体パッケージとその製造方法、半導体モジュール、および電子機器
JPWO2005114730A1 (ja) * 2004-05-20 2008-03-27 スパンション エルエルシー 半導体装置の製造方法および半導体装置
US7733408B2 (en) 2005-03-29 2010-06-08 Sharp Kabushiki Kaisha Optical device module, optical path fixing device, and method for manufacturing optical device module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08306855A (ja) * 1995-04-27 1996-11-22 Lg Semicon Co Ltd 半導体パッケージ、リードフレーム、回路基板、半導体パッケージモールディング用金型及び電子回路盤並にリードフレームの製造方法
JPWO2005114730A1 (ja) * 2004-05-20 2008-03-27 スパンション エルエルシー 半導体装置の製造方法および半導体装置
US7733408B2 (en) 2005-03-29 2010-06-08 Sharp Kabushiki Kaisha Optical device module, optical path fixing device, and method for manufacturing optical device module
WO2007058073A1 (ja) * 2005-11-16 2007-05-24 Sharp Kabushiki Kaisha 半導体パッケージとその製造方法、半導体モジュール、および電子機器
JP2007142042A (ja) * 2005-11-16 2007-06-07 Sharp Corp 半導体パッケージとその製造方法，半導体モジュール，および電子機器

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