JPS5517495B2 - - Google Patents
Info
- Publication number
- JPS5517495B2 JPS5517495B2 JP5799774A JP5799774A JPS5517495B2 JP S5517495 B2 JPS5517495 B2 JP S5517495B2 JP 5799774 A JP5799774 A JP 5799774A JP 5799774 A JP5799774 A JP 5799774A JP S5517495 B2 JPS5517495 B2 JP S5517495B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8222—Bipolar technology
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
- H10B20/10—ROM devices comprising bipolar components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Weting (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36414873A | 1973-05-25 | 1973-05-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5022582A JPS5022582A (en) | 1975-03-11 |
JPS5517495B2 true JPS5517495B2 (en) | 1980-05-12 |
Family
ID=23433234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5799774A Expired JPS5517495B2 (en) | 1973-05-25 | 1974-05-24 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5517495B2 (en) |
CA (1) | CA1005171A (en) |
DE (1) | DE2419817A1 (en) |
FR (1) | FR2231111A1 (en) |
NL (1) | NL7404614A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5267979A (en) * | 1975-12-04 | 1977-06-06 | Mitsubishi Electric Corp | Manufacture of semiconductor |
JPS5269276A (en) * | 1975-12-05 | 1977-06-08 | Mitsubishi Electric Corp | Production of semiconductor device |
JPS52127775A (en) * | 1976-04-19 | 1977-10-26 | Fujitsu Ltd | Semiconductor integrated circuit and its preparation |
JPS54112944A (en) * | 1978-02-24 | 1979-09-04 | Oopatsuku Kk | Conductive adhesives |
JPS54158876A (en) * | 1978-06-06 | 1979-12-15 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS5624970A (en) * | 1979-08-07 | 1981-03-10 | Nec Corp | Manufacture of semiconductor device |
US6322620B1 (en) | 2000-11-16 | 2001-11-27 | National Starch And Chemical Investment Holding Corporation | Conductive ink composition |
-
1974
- 1974-02-22 CA CA193,203A patent/CA1005171A/en not_active Expired
- 1974-04-04 NL NL7404614A patent/NL7404614A/xx not_active Application Discontinuation
- 1974-04-24 DE DE2419817A patent/DE2419817A1/en not_active Withdrawn
- 1974-05-24 JP JP5799774A patent/JPS5517495B2/ja not_active Expired
- 1974-05-24 FR FR7418075A patent/FR2231111A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2231111A1 (en) | 1974-12-20 |
CA1005171A (en) | 1977-02-08 |
NL7404614A (en) | 1974-11-27 |
DE2419817A1 (en) | 1974-12-05 |
FR2231111B1 (en) | 1978-03-31 |
JPS5022582A (en) | 1975-03-11 |