JPS5516751A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS5516751A
JPS5516751A JP8933478A JP8933478A JPS5516751A JP S5516751 A JPS5516751 A JP S5516751A JP 8933478 A JP8933478 A JP 8933478A JP 8933478 A JP8933478 A JP 8933478A JP S5516751 A JPS5516751 A JP S5516751A
Authority
JP
Japan
Prior art keywords
wetness
soldering
measured
composition
melted solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8933478A
Other languages
Japanese (ja)
Inventor
Mitsuo Shirata
Toshihiro Shima
Yoichiro Maehara
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8933478A priority Critical patent/JPS5516751A/en
Publication of JPS5516751A publication Critical patent/JPS5516751A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02—Investigating surface tension of liquids
    • G01N2013/0225—Investigating surface tension of liquids of liquid metals or solder

Abstract

PURPOSE: To prevent poor quality of soldering by holding the composition of melted solder within a certain range based on the difference in comparison of the wetness of melted solder with the standard characteristics after it is measured.
CONSTITUTION: A standard test piece 4 hangs with a hanger 9 of a senser 5 and immersed into a melted solder 3 with a given composition. The standard characteristics of the wetness is plotted in a chart. From the wetness characteristics on the chart, determined are a shift time T during which the thrusting force of the test piece 4 decreases due to insufficient wetness leading to the generation of sucking force accompanied by wetting, and a limit level to which no poor soldering occurs at a saturation value H of sucking force due to wetting. Then, in the actual soldering work, wetness is measured from the values of T and H. The measured value is compared with the limit value for T and H. Based on the difference, the composition of the solder is maintained constant thereby preventing poor soldering.
COPYRIGHT: (C)1980,JPO&Japio
JP8933478A 1978-07-24 1978-07-24 Soldering method Pending JPS5516751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8933478A JPS5516751A (en) 1978-07-24 1978-07-24 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8933478A JPS5516751A (en) 1978-07-24 1978-07-24 Soldering method

Publications (1)

Publication Number Publication Date
JPS5516751A true JPS5516751A (en) 1980-02-05

Family

ID=13967781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8933478A Pending JPS5516751A (en) 1978-07-24 1978-07-24 Soldering method

Country Status (1)

Country Link
JP (1) JPS5516751A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4467638A (en) * 1983-05-13 1984-08-28 Rca Corporation Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4467638A (en) * 1983-05-13 1984-08-28 Rca Corporation Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system

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