JPS55162236A - Manufacture of resin-sealed electronic component - Google Patents

Manufacture of resin-sealed electronic component

Info

Publication number
JPS55162236A
JPS55162236A JP7089079A JP7089079A JPS55162236A JP S55162236 A JPS55162236 A JP S55162236A JP 7089079 A JP7089079 A JP 7089079A JP 7089079 A JP7089079 A JP 7089079A JP S55162236 A JPS55162236 A JP S55162236A
Authority
JP
Japan
Prior art keywords
roll
resin
electronic component
rolls
burrs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7089079A
Other languages
Japanese (ja)
Other versions
JPS5932058B2 (en
Inventor
Yutaka Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7089079A priority Critical patent/JPS5932058B2/en
Publication of JPS55162236A publication Critical patent/JPS55162236A/en
Publication of JPS5932058B2 publication Critical patent/JPS5932058B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To make dust removal process unnecessary and operate excess resin removal continuously by the method wherein, while external leads connected to an electronic component are pulled out, resin sealing is operated, and excess resin film exuded at this time is removed by the deformation of elastic bodies. CONSTITUTION:A plurality of leads 1 projecting from resin-sealed type electronic component 4 are attached with burrs at the places where they pass through the component. These burrs are removed by using the following mechanisms. That is, place upper roll 17 consisting of upper roll 15, whose outer circumferential part is fitted with elastic body 16 made of urethane rubber via rubber lining, and lower roll 18 having solid character, in such a manner that the upper and lower rolls face each other. This is made as roll mechanism I. Roll mechanism II is formed, which is of the same shape as roll mechanism I, but its upper roll 19 is a solid body and its lower roll 20 consists of elastic body 21. These mechanisms are arranged in series. Burr 11 is passed between the rolls of mechanism I and then between the rolls of mechanism II, and burr 11 is removed by the friction produced by the deformation of elastic bodies 16 and 21.
JP7089079A 1979-06-04 1979-06-04 Manufacturing method for resin-sealed electronic components Expired JPS5932058B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7089079A JPS5932058B2 (en) 1979-06-04 1979-06-04 Manufacturing method for resin-sealed electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7089079A JPS5932058B2 (en) 1979-06-04 1979-06-04 Manufacturing method for resin-sealed electronic components

Publications (2)

Publication Number Publication Date
JPS55162236A true JPS55162236A (en) 1980-12-17
JPS5932058B2 JPS5932058B2 (en) 1984-08-06

Family

ID=13444567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7089079A Expired JPS5932058B2 (en) 1979-06-04 1979-06-04 Manufacturing method for resin-sealed electronic components

Country Status (1)

Country Link
JP (1) JPS5932058B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60213004A (en) * 1984-04-09 1985-10-25 日立エーアイシー株式会社 Apparatus for producing electronic part
JPS60218802A (en) * 1984-04-13 1985-11-01 日立エーアイシー株式会社 Apparatus for producing electronic part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60213004A (en) * 1984-04-09 1985-10-25 日立エーアイシー株式会社 Apparatus for producing electronic part
JPH0326525B2 (en) * 1984-04-09 1991-04-11 Hitachi Ee Ai Shii Kk
JPS60218802A (en) * 1984-04-13 1985-11-01 日立エーアイシー株式会社 Apparatus for producing electronic part
JPH0326526B2 (en) * 1984-04-13 1991-04-11 Hitachi Ee Ai Shii Kk

Also Published As

Publication number Publication date
JPS5932058B2 (en) 1984-08-06

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