JPS55154564U - - Google Patents

Info

Publication number
JPS55154564U
JPS55154564U JP5537379U JP5537379U JPS55154564U JP S55154564 U JPS55154564 U JP S55154564U JP 5537379 U JP5537379 U JP 5537379U JP 5537379 U JP5537379 U JP 5537379U JP S55154564 U JPS55154564 U JP S55154564U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5537379U
Other languages
Japanese (ja)
Other versions
JPS603587Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5537379U priority Critical patent/JPS603587Y2/en
Publication of JPS55154564U publication Critical patent/JPS55154564U/ja
Application granted granted Critical
Publication of JPS603587Y2 publication Critical patent/JPS603587Y2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP5537379U 1979-04-24 1979-04-24 light emitting diode board Expired JPS603587Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5537379U JPS603587Y2 (en) 1979-04-24 1979-04-24 light emitting diode board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5537379U JPS603587Y2 (en) 1979-04-24 1979-04-24 light emitting diode board

Publications (2)

Publication Number Publication Date
JPS55154564U true JPS55154564U (en) 1980-11-07
JPS603587Y2 JPS603587Y2 (en) 1985-01-31

Family

ID=28951129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5537379U Expired JPS603587Y2 (en) 1979-04-24 1979-04-24 light emitting diode board

Country Status (1)

Country Link
JP (1) JPS603587Y2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235787A (en) * 1986-04-07 1987-10-15 Koito Mfg Co Ltd Illuminating device
JPS63101987U (en) * 1986-12-22 1988-07-02
JP2004259958A (en) * 2003-02-26 2004-09-16 Kyocera Corp Package for housing light emitting element, and light emitting device
JP2006517738A (en) * 2003-02-07 2006-07-27 松下電器産業株式会社 Metal base substrate for light emitter, light emission source, illumination device and display device
WO2011078010A1 (en) 2009-12-25 2011-06-30 富士フイルム株式会社 Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element
EP2384100A2 (en) 2010-04-28 2011-11-02 Fujifilm Corporation Insulated light-reflective substrate
EP2420869A2 (en) 2010-08-16 2012-02-22 Fujifilm Corporation Radiation reflection plate for LED

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235787A (en) * 1986-04-07 1987-10-15 Koito Mfg Co Ltd Illuminating device
JPS63101987U (en) * 1986-12-22 1988-07-02
JP2006517738A (en) * 2003-02-07 2006-07-27 松下電器産業株式会社 Metal base substrate for light emitter, light emission source, illumination device and display device
JP2004259958A (en) * 2003-02-26 2004-09-16 Kyocera Corp Package for housing light emitting element, and light emitting device
WO2011078010A1 (en) 2009-12-25 2011-06-30 富士フイルム株式会社 Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element
EP2384100A2 (en) 2010-04-28 2011-11-02 Fujifilm Corporation Insulated light-reflective substrate
EP2420869A2 (en) 2010-08-16 2012-02-22 Fujifilm Corporation Radiation reflection plate for LED

Also Published As

Publication number Publication date
JPS603587Y2 (en) 1985-01-31

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