JPS55152165A - Treatment of metal wire strip - Google Patents
Treatment of metal wire stripInfo
- Publication number
- JPS55152165A JPS55152165A JP5935979A JP5935979A JPS55152165A JP S55152165 A JPS55152165 A JP S55152165A JP 5935979 A JP5935979 A JP 5935979A JP 5935979 A JP5935979 A JP 5935979A JP S55152165 A JPS55152165 A JP S55152165A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- molten metal
- wire strip
- tank
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title abstract 11
- 238000007747 plating Methods 0.000 abstract 8
- 238000000034 method Methods 0.000 abstract 2
- 238000007669 thermal treatment Methods 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
- C23C2/29—Cooling or quenching
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Thermal Sciences (AREA)
- Coating With Molten Metal (AREA)
Abstract
PURPOSE:To simultaneously provide the metal wire strip with molten metal plating and the thermal treatment by a method wherein the metal wire strip is successively passed through plating tanks and heated by current supplied from such electrodes as formed by molten metal in each of plural plating tanks. CONSTITUTION:Molten metal 8 is prepared in the first plating tank 1 and molten metal 9 in the second plating tank 2. Both tanks 1, 2 are supplied with power from source 4. Metal wire strip W is surface-cleaned 5, is guided into the tank 1 to form an underplating layer with the molten metal 8, then the plated layer is scrubbed with a wiper 1B. The undercoated wire strip W is sent to the tank 2 where plating is made with the new molten metal 9. A die 2B is used to adjust plating thickness of the wire strip W, which is cooled in a cooling tank 6, and is wound by winding device. In this process, the molten metal 8 and 9 work as electrodes, providing current to the wire strip W to heat it to a specified temperature. Thus, both plating and thermal treatment is simultaneously performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5935979A JPS55152165A (en) | 1979-05-15 | 1979-05-15 | Treatment of metal wire strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5935979A JPS55152165A (en) | 1979-05-15 | 1979-05-15 | Treatment of metal wire strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55152165A true JPS55152165A (en) | 1980-11-27 |
Family
ID=13110985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5935979A Pending JPS55152165A (en) | 1979-05-15 | 1979-05-15 | Treatment of metal wire strip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55152165A (en) |
-
1979
- 1979-05-15 JP JP5935979A patent/JPS55152165A/en active Pending
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