JPS55149304A - Adhesive resin - Google Patents

Adhesive resin

Info

Publication number
JPS55149304A
JPS55149304A JP5779579A JP5779579A JPS55149304A JP S55149304 A JPS55149304 A JP S55149304A JP 5779579 A JP5779579 A JP 5779579A JP 5779579 A JP5779579 A JP 5779579A JP S55149304 A JPS55149304 A JP S55149304A
Authority
JP
Japan
Prior art keywords
acid
resin
chlorinated
adhesive resin
component comprises
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5779579A
Other languages
Japanese (ja)
Inventor
Shoichi Makimoto
Hideyo Shigematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Aluminum KK
Original Assignee
Toyo Aluminum KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Aluminum KK filed Critical Toyo Aluminum KK
Priority to JP5779579A priority Critical patent/JPS55149304A/en
Publication of JPS55149304A publication Critical patent/JPS55149304A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide an adhesive resin with excellent heat and water resistance based on chlorinated carboxylated polypropylene of which a chlorine content is within a specific range obtained by chlorinating a modified polypropylene resin containing a caboxyl group.
CONSTITUTION: A modified polypropylene resin containing a carboxyl group with acid value 0.1W100mg KOH/g is chlorinated to prepare a chlorinated carboxylated polypropylene (a) of which a chlorine constant is 5W50wt%. Subsequently, this resin 10W99pts.wt. is mixed with 90W1pts.wt. of a linear copolymerized polyester resin (b) of which 95W50mol% of an acid component is terephthalic acid residue, 20W70mol% of an alcohol component is ethylene glycol residue, 5W50mol% of a residual acid component comprises adipic acid, sebacic acid or the like and 80W 30mol% of a residual alcohol component comprises diethylene glycol, triethylene glycol or the like to obtain an objective adhesive resin.
COPYRIGHT: (C)1980,JPO&Japio
JP5779579A 1979-05-10 1979-05-10 Adhesive resin Pending JPS55149304A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5779579A JPS55149304A (en) 1979-05-10 1979-05-10 Adhesive resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5779579A JPS55149304A (en) 1979-05-10 1979-05-10 Adhesive resin

Publications (1)

Publication Number Publication Date
JPS55149304A true JPS55149304A (en) 1980-11-20

Family

ID=13065818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5779579A Pending JPS55149304A (en) 1979-05-10 1979-05-10 Adhesive resin

Country Status (1)

Country Link
JP (1) JPS55149304A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57137147A (en) * 1981-02-17 1982-08-24 Asahipen Corp Method of attaching thermoplastic resin to metal material
JPS60133081A (en) * 1983-12-21 1985-07-16 Mitsui Petrochem Ind Ltd Adhesive
JPH02218778A (en) * 1989-12-14 1990-08-31 Mitsui Petrochem Ind Ltd Adhesive composed of chlorine-modified polyolefin
JPH07235817A (en) * 1993-12-28 1995-09-05 Nec Corp Telescopic antenna for ic memory card radio modem
JP2007091904A (en) * 2005-09-29 2007-04-12 Riidaa:Kk Heat-resistant covering agent and lid material using the covering agent
WO2009081821A1 (en) * 2007-12-21 2009-07-02 Toagosei Co., Ltd. Hot melt adhesive composition
JP2013213110A (en) * 2012-03-30 2013-10-17 Toyo Ink Sc Holdings Co Ltd Heat-sealable resin composition

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010916A (en) * 1973-05-26 1975-02-04
JPS5214683A (en) * 1975-07-18 1977-02-03 Mitsubishi Petrochem Co Ltd Process for preparing a laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010916A (en) * 1973-05-26 1975-02-04
JPS5214683A (en) * 1975-07-18 1977-02-03 Mitsubishi Petrochem Co Ltd Process for preparing a laminate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57137147A (en) * 1981-02-17 1982-08-24 Asahipen Corp Method of attaching thermoplastic resin to metal material
JPS6121149B2 (en) * 1981-02-17 1986-05-26 Asahi Pen
JPS60133081A (en) * 1983-12-21 1985-07-16 Mitsui Petrochem Ind Ltd Adhesive
JPH0454712B2 (en) * 1983-12-21 1992-09-01 Mitsui Petrochemical Ind
JPH02218778A (en) * 1989-12-14 1990-08-31 Mitsui Petrochem Ind Ltd Adhesive composed of chlorine-modified polyolefin
JPH07235817A (en) * 1993-12-28 1995-09-05 Nec Corp Telescopic antenna for ic memory card radio modem
JP2007091904A (en) * 2005-09-29 2007-04-12 Riidaa:Kk Heat-resistant covering agent and lid material using the covering agent
WO2009081821A1 (en) * 2007-12-21 2009-07-02 Toagosei Co., Ltd. Hot melt adhesive composition
JP5299287B2 (en) * 2007-12-21 2013-09-25 東亞合成株式会社 Hot melt adhesive composition
JP2013213110A (en) * 2012-03-30 2013-10-17 Toyo Ink Sc Holdings Co Ltd Heat-sealable resin composition

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