JPS5514712U - - Google Patents
Info
- Publication number
- JPS5514712U JPS5514712U JP1978096304U JP9630478U JPS5514712U JP S5514712 U JPS5514712 U JP S5514712U JP 1978096304 U JP1978096304 U JP 1978096304U JP 9630478 U JP9630478 U JP 9630478U JP S5514712 U JPS5514712 U JP S5514712U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978096304U JPS5849637Y2 (ja) | 1978-07-14 | 1978-07-14 | 厚膜配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978096304U JPS5849637Y2 (ja) | 1978-07-14 | 1978-07-14 | 厚膜配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5514712U true JPS5514712U (ja) | 1980-01-30 |
| JPS5849637Y2 JPS5849637Y2 (ja) | 1983-11-12 |
Family
ID=29030067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978096304U Expired JPS5849637Y2 (ja) | 1978-07-14 | 1978-07-14 | 厚膜配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5849637Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57123477U (ja) * | 1981-01-27 | 1982-07-31 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100482041C (zh) | 2002-05-17 | 2009-04-22 | 日本电气株式会社 | 印刷布线板 |
-
1978
- 1978-07-14 JP JP1978096304U patent/JPS5849637Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57123477U (ja) * | 1981-01-27 | 1982-07-31 | ||
| JPS6243106Y2 (ja) * | 1981-01-27 | 1987-11-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5849637Y2 (ja) | 1983-11-12 |