JPS5514712U - - Google Patents
Info
- Publication number
- JPS5514712U JPS5514712U JP1978096304U JP9630478U JPS5514712U JP S5514712 U JPS5514712 U JP S5514712U JP 1978096304 U JP1978096304 U JP 1978096304U JP 9630478 U JP9630478 U JP 9630478U JP S5514712 U JPS5514712 U JP S5514712U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978096304U JPS5849637Y2 (ja) | 1978-07-14 | 1978-07-14 | 厚膜配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978096304U JPS5849637Y2 (ja) | 1978-07-14 | 1978-07-14 | 厚膜配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5514712U true JPS5514712U (https=) | 1980-01-30 |
| JPS5849637Y2 JPS5849637Y2 (ja) | 1983-11-12 |
Family
ID=29030067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978096304U Expired JPS5849637Y2 (ja) | 1978-07-14 | 1978-07-14 | 厚膜配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5849637Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57123477U (https=) * | 1981-01-27 | 1982-07-31 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7180005B2 (en) | 2002-05-17 | 2007-02-20 | Nec Corporation | Printed wiring board |
-
1978
- 1978-07-14 JP JP1978096304U patent/JPS5849637Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57123477U (https=) * | 1981-01-27 | 1982-07-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5849637Y2 (ja) | 1983-11-12 |