JPS55145153A - Glass seal bonding alloy - Google Patents

Glass seal bonding alloy

Info

Publication number
JPS55145153A
JPS55145153A JP5287679A JP5287679A JPS55145153A JP S55145153 A JPS55145153 A JP S55145153A JP 5287679 A JP5287679 A JP 5287679A JP 5287679 A JP5287679 A JP 5287679A JP S55145153 A JPS55145153 A JP S55145153A
Authority
JP
Japan
Prior art keywords
alloy
glass
seal bonding
glass seal
bonding alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5287679A
Other languages
Japanese (ja)
Inventor
Junichi Okada
Masao Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP5287679A priority Critical patent/JPS55145153A/en
Publication of JPS55145153A publication Critical patent/JPS55145153A/en
Pending legal-status Critical Current

Links

Landscapes

  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE: To improve the wettability of the title Fe-Ni-Co alloy to glass by regulating the Mg content of an Fe-base Fe-Ni-Co alloy of a specified composition.
CONSTITUTION: The Mg content of an Fe-base Fe-Ni-Co alloy contg. Ni 28.8W 29.8% and Co 15.8W16.8% is regulated to Mg≤0.01%. A glass seal bonding material made of the resulting Fe-Ni-Co alloy exhibits appropriate wettability to borosilicate glass and make the defective rate zero in manufacture of matching seal type airtight terminals.
COPYRIGHT: (C)1980,JPO&Japio
JP5287679A 1979-04-28 1979-04-28 Glass seal bonding alloy Pending JPS55145153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5287679A JPS55145153A (en) 1979-04-28 1979-04-28 Glass seal bonding alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5287679A JPS55145153A (en) 1979-04-28 1979-04-28 Glass seal bonding alloy

Publications (1)

Publication Number Publication Date
JPS55145153A true JPS55145153A (en) 1980-11-12

Family

ID=12927073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5287679A Pending JPS55145153A (en) 1979-04-28 1979-04-28 Glass seal bonding alloy

Country Status (1)

Country Link
JP (1) JPS55145153A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117282771A (en) * 2023-11-21 2023-12-26 西安稀有金属材料研究院有限公司 Preparation method of AgCu15/4J29 composite strip for electronic packaging

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117282771A (en) * 2023-11-21 2023-12-26 西安稀有金属材料研究院有限公司 Preparation method of AgCu15/4J29 composite strip for electronic packaging
CN117282771B (en) * 2023-11-21 2024-02-06 西安稀有金属材料研究院有限公司 Preparation method of AgCu15/4J29 composite strip for electronic packaging

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