JPS55141734A - Method for coating leadless part installed on printed circuit board - Google Patents

Method for coating leadless part installed on printed circuit board

Info

Publication number
JPS55141734A
JPS55141734A JP4950479A JP4950479A JPS55141734A JP S55141734 A JPS55141734 A JP S55141734A JP 4950479 A JP4950479 A JP 4950479A JP 4950479 A JP4950479 A JP 4950479A JP S55141734 A JPS55141734 A JP S55141734A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
coating
leadless
part installed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4950479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS621278B2 (cg-RX-API-DMAC10.html
Inventor
Eiichi Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4950479A priority Critical patent/JPS55141734A/ja
Publication of JPS55141734A publication Critical patent/JPS55141734A/ja
Publication of JPS621278B2 publication Critical patent/JPS621278B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W90/754—

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP4950479A 1979-04-20 1979-04-20 Method for coating leadless part installed on printed circuit board Granted JPS55141734A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4950479A JPS55141734A (en) 1979-04-20 1979-04-20 Method for coating leadless part installed on printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4950479A JPS55141734A (en) 1979-04-20 1979-04-20 Method for coating leadless part installed on printed circuit board

Publications (2)

Publication Number Publication Date
JPS55141734A true JPS55141734A (en) 1980-11-05
JPS621278B2 JPS621278B2 (cg-RX-API-DMAC10.html) 1987-01-12

Family

ID=12832958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4950479A Granted JPS55141734A (en) 1979-04-20 1979-04-20 Method for coating leadless part installed on printed circuit board

Country Status (1)

Country Link
JP (1) JPS55141734A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58204546A (ja) * 1982-05-25 1983-11-29 Citizen Watch Co Ltd Ｉｃの封止方法
JPS6266696A (ja) * 1985-09-19 1987-03-26 株式会社日立製作所 電子回路板
JPH02205390A (ja) * 1989-02-03 1990-08-15 Nippon Retsuku Kk 電気配線基板の表面実装に於ける電気部品の樹脂封止方法
JP2008288250A (ja) * 2007-05-15 2008-11-27 Nec Electronics Corp マルチチップパッケージ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58204546A (ja) * 1982-05-25 1983-11-29 Citizen Watch Co Ltd Ｉｃの封止方法
JPS6266696A (ja) * 1985-09-19 1987-03-26 株式会社日立製作所 電子回路板
JPH02205390A (ja) * 1989-02-03 1990-08-15 Nippon Retsuku Kk 電気配線基板の表面実装に於ける電気部品の樹脂封止方法
JP2008288250A (ja) * 2007-05-15 2008-11-27 Nec Electronics Corp マルチチップパッケージ

Also Published As

Publication number Publication date
JPS621278B2 (cg-RX-API-DMAC10.html) 1987-01-12

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