JPS55138603A - Detecting system of pattern position - Google Patents

Detecting system of pattern position

Info

Publication number
JPS55138603A
JPS55138603A JP4535279A JP4535279A JPS55138603A JP S55138603 A JPS55138603 A JP S55138603A JP 4535279 A JP4535279 A JP 4535279A JP 4535279 A JP4535279 A JP 4535279A JP S55138603 A JPS55138603 A JP S55138603A
Authority
JP
Japan
Prior art keywords
pattern
coordinates
partial
position coordinates
coincidence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4535279A
Other languages
Japanese (ja)
Other versions
JPH02642B2 (en
Inventor
Takafumi Miyatake
Seiji Kashioka
Yoshihiro Shima
Takeshi Karasuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4535279A priority Critical patent/JPS55138603A/en
Publication of JPS55138603A publication Critical patent/JPS55138603A/en
Publication of JPH02642B2 publication Critical patent/JPH02642B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)

Abstract

PURPOSE: To enable to distinguish an object pattern exactly, by processing video information, finding the position coordinates of pattern in each retrieval region, and judging successively.
CONSTITUTION: A video signal from an image pick-up device 40 is stored in a video memory 45 through a binary conversion circuit 44. At every corresponding bit, a collating-adding circuit 48 compares and collates a standard pattern from a register 47 and a partial pattern from a cut-out circuit 46, and outputs a signal showing the degree of coincidence. After scanning one screen, the maximum degree of coincidence between standard pattern and partial pattern and position coordinates of partial patterns in all divisions are stored in memories 57, 58. A control device 60 successively checks the relative position relation of the coordinates in each retrieval region, and locates a set of coordinates satisfying a specified position relation, and recognizes this set as position coordinates of an object pattern.
COPYRIGHT: (C)1980,JPO&Japio
JP4535279A 1979-04-16 1979-04-16 Detecting system of pattern position Granted JPS55138603A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4535279A JPS55138603A (en) 1979-04-16 1979-04-16 Detecting system of pattern position

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4535279A JPS55138603A (en) 1979-04-16 1979-04-16 Detecting system of pattern position

Publications (2)

Publication Number Publication Date
JPS55138603A true JPS55138603A (en) 1980-10-29
JPH02642B2 JPH02642B2 (en) 1990-01-09

Family

ID=12716877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4535279A Granted JPS55138603A (en) 1979-04-16 1979-04-16 Detecting system of pattern position

Country Status (1)

Country Link
JP (1) JPS55138603A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134882A (en) * 1984-12-05 1986-06-21 Hitachi Electronics Eng Co Ltd Device for inspecting pattern external appearance of printed board
JPH05126531A (en) * 1990-07-23 1993-05-21 Toshiba Eng Co Ltd Inspecting device
JP2009524073A (en) * 2006-02-08 2009-06-25 アーテーゲー ルーテル ウント メルツァー ゲーエムベーハー Method and apparatus for inspection of non-componentized circuit boards

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296627A (en) * 1990-04-16 1991-12-27 Furatsukusu:Kk Method and device for discriminating color of skin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134882A (en) * 1984-12-05 1986-06-21 Hitachi Electronics Eng Co Ltd Device for inspecting pattern external appearance of printed board
JPH05126531A (en) * 1990-07-23 1993-05-21 Toshiba Eng Co Ltd Inspecting device
JP2009524073A (en) * 2006-02-08 2009-06-25 アーテーゲー ルーテル ウント メルツァー ゲーエムベーハー Method and apparatus for inspection of non-componentized circuit boards

Also Published As

Publication number Publication date
JPH02642B2 (en) 1990-01-09

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