JPS55132945U - - Google Patents

Info

Publication number
JPS55132945U
JPS55132945U JP3274979U JP3274979U JPS55132945U JP S55132945 U JPS55132945 U JP S55132945U JP 3274979 U JP3274979 U JP 3274979U JP 3274979 U JP3274979 U JP 3274979U JP S55132945 U JPS55132945 U JP S55132945U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3274979U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3274979U priority Critical patent/JPS55132945U/ja
Publication of JPS55132945U publication Critical patent/JPS55132945U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP3274979U 1979-03-13 1979-03-13 Pending JPS55132945U (ref)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3274979U JPS55132945U (ref) 1979-03-13 1979-03-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3274979U JPS55132945U (ref) 1979-03-13 1979-03-13

Publications (1)

Publication Number Publication Date
JPS55132945U true JPS55132945U (ref) 1980-09-20

Family

ID=28886846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3274979U Pending JPS55132945U (ref) 1979-03-13 1979-03-13

Country Status (1)

Country Link
JP (1) JPS55132945U (ref)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844750A (ja) * 1981-09-11 1983-03-15 Hitachi Ltd 半導体装置
JPS6254958A (ja) * 1985-09-04 1987-03-10 Hitachi Ltd 圧接型半導体装置
JPS6450537A (en) * 1987-08-21 1989-02-27 Mitsubishi Electric Corp Compression bonded type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844750A (ja) * 1981-09-11 1983-03-15 Hitachi Ltd 半導体装置
JPS6254958A (ja) * 1985-09-04 1987-03-10 Hitachi Ltd 圧接型半導体装置
JPS6450537A (en) * 1987-08-21 1989-02-27 Mitsubishi Electric Corp Compression bonded type semiconductor device

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