JPS55132945U - - Google Patents
Info
- Publication number
- JPS55132945U JPS55132945U JP3274979U JP3274979U JPS55132945U JP S55132945 U JPS55132945 U JP S55132945U JP 3274979 U JP3274979 U JP 3274979U JP 3274979 U JP3274979 U JP 3274979U JP S55132945 U JPS55132945 U JP S55132945U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3274979U JPS55132945U (ref) | 1979-03-13 | 1979-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3274979U JPS55132945U (ref) | 1979-03-13 | 1979-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55132945U true JPS55132945U (ref) | 1980-09-20 |
Family
ID=28886846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3274979U Pending JPS55132945U (ref) | 1979-03-13 | 1979-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55132945U (ref) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844750A (ja) * | 1981-09-11 | 1983-03-15 | Hitachi Ltd | 半導体装置 |
| JPS6254958A (ja) * | 1985-09-04 | 1987-03-10 | Hitachi Ltd | 圧接型半導体装置 |
| JPS6450537A (en) * | 1987-08-21 | 1989-02-27 | Mitsubishi Electric Corp | Compression bonded type semiconductor device |
-
1979
- 1979-03-13 JP JP3274979U patent/JPS55132945U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844750A (ja) * | 1981-09-11 | 1983-03-15 | Hitachi Ltd | 半導体装置 |
| JPS6254958A (ja) * | 1985-09-04 | 1987-03-10 | Hitachi Ltd | 圧接型半導体装置 |
| JPS6450537A (en) * | 1987-08-21 | 1989-02-27 | Mitsubishi Electric Corp | Compression bonded type semiconductor device |