JPS55128363A - Flux foaming method of automatic soldering device - Google Patents

Flux foaming method of automatic soldering device

Info

Publication number
JPS55128363A
JPS55128363A JP3625879A JP3625879A JPS55128363A JP S55128363 A JPS55128363 A JP S55128363A JP 3625879 A JP3625879 A JP 3625879A JP 3625879 A JP3625879 A JP 3625879A JP S55128363 A JPS55128363 A JP S55128363A
Authority
JP
Japan
Prior art keywords
resin
flux
colophonium
soldering device
foaming method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3625879A
Other languages
Japanese (ja)
Inventor
Kazuhisa Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP3625879A priority Critical patent/JPS55128363A/en
Publication of JPS55128363A publication Critical patent/JPS55128363A/en
Pending legal-status Critical Current

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  • Coating Apparatus (AREA)

Abstract

PURPOSE: To obtain stable and even foaming by providing the open pores of the specified porosity and pore sizes in macromolecular resin, such as acrylic resin and PS, then dipping the same in liquid-form flux composed primarily of colophonium thereafter passing air.
CONSTITUTION: The open pores of porosities 30W50%, pore sizes 50W500μ are provided in macromolecular synthetic resin, such as acrylic resin, PS, PE, PP or PVC. Thence, this synthetic resin is dipped in liquid-form flux composed primarily of colophonium and air is passed thereto to cause the resin to foam. With this method, the formation of bubbles is less if the porosity is less than 30% and more than necessary foaming occurs if it exceeds 50% and when such flux is coated on printed substrates, flux excess occurs.
COPYRIGHT: (C)1980,JPO&Japio
JP3625879A 1979-03-29 1979-03-29 Flux foaming method of automatic soldering device Pending JPS55128363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3625879A JPS55128363A (en) 1979-03-29 1979-03-29 Flux foaming method of automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3625879A JPS55128363A (en) 1979-03-29 1979-03-29 Flux foaming method of automatic soldering device

Publications (1)

Publication Number Publication Date
JPS55128363A true JPS55128363A (en) 1980-10-04

Family

ID=12464738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3625879A Pending JPS55128363A (en) 1979-03-29 1979-03-29 Flux foaming method of automatic soldering device

Country Status (1)

Country Link
JP (1) JPS55128363A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60146564U (en) * 1984-03-07 1985-09-28 近藤　権士 flux tank
JPS62189871U (en) * 1986-05-22 1987-12-03

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60146564U (en) * 1984-03-07 1985-09-28 近藤　権士 flux tank
JPS62189871U (en) * 1986-05-22 1987-12-03
JPH0428693Y2 (en) * 1986-05-22 1992-07-13

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