JPS55126208A - Light emitting semiconductor device - Google Patents

Light emitting semiconductor device

Info

Publication number
JPS55126208A
JPS55126208A JP3416179A JP3416179A JPS55126208A JP S55126208 A JPS55126208 A JP S55126208A JP 3416179 A JP3416179 A JP 3416179A JP 3416179 A JP3416179 A JP 3416179A JP S55126208 A JPS55126208 A JP S55126208A
Authority
JP
Japan
Prior art keywords
light emitting
light
enters
emitting device
reflecting plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3416179A
Other languages
Japanese (ja)
Inventor
Yosuke Furuta
Hajime Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3416179A priority Critical patent/JPS55126208A/en
Publication of JPS55126208A publication Critical patent/JPS55126208A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: To improve the transmission efficiency of optical output for obtaining monitor light, by designing an inclined reflecting plane on one end of a pipe-formed photoconductor of which other end is subjected to entry of part of light from a semiconductor light emitting device disposed in a package.
CONSTITUTION: A semiconductor light emitting device 101, such as light emitting diode and semiconductor laser, is disposed in a package 102, and part of the light from this semiconductor light emitting device 101 enters one end of a pipe-formed photoconductor 106, of which other end should be an inclined reflecting plane 1-9. In this constitution, the light entering the end of the photoconductor 106 is reflected by the reflecting plane 109 of the other end thereof, and enters a photo detector 107, and is taken out as a monitor light. Therefore, since the device is not intended to branch the light which enters an optical fiber 105 and is transmitted, the optical output does not decrease. Besides, beam splitter and lens are not necessary, so that the device may be assembled easily and miniaturized.
COPYRIGHT: (C)1980,JPO&Japio
JP3416179A 1979-03-23 1979-03-23 Light emitting semiconductor device Pending JPS55126208A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3416179A JPS55126208A (en) 1979-03-23 1979-03-23 Light emitting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3416179A JPS55126208A (en) 1979-03-23 1979-03-23 Light emitting semiconductor device

Publications (1)

Publication Number Publication Date
JPS55126208A true JPS55126208A (en) 1980-09-29

Family

ID=12406474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3416179A Pending JPS55126208A (en) 1979-03-23 1979-03-23 Light emitting semiconductor device

Country Status (1)

Country Link
JP (1) JPS55126208A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608813A (en) * 1983-06-10 1985-01-17 ジ−メンス・アクチエンゲゼルシヤフト Optical fiber connector
US4575181A (en) * 1983-04-26 1986-03-11 Tokyo Shibaura Denki Kabushiki Kaisha Optical fiber assembly with cladding light scattering means
EP0732781A1 (en) * 1995-03-14 1996-09-18 Tesa Brown & Sharpe S.A. Module comprising a controlled diode laser and electrooptical device using the same
EP1096285A2 (en) * 1999-11-01 2001-05-02 GSI Lumonics Ltd. Laser to optical fibre coupling
EP1329998A1 (en) * 2002-01-21 2003-07-23 Agilent Technologies, Inc. (a Delaware corporation) An arrangement for monitoring the emission wavelength of a laser source
US7200289B2 (en) 2000-03-15 2007-04-03 Sumitomo Osaka Cement Co., Ltd. Optical waveguide modulator with output light monitor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3409709A (en) * 1964-07-23 1968-11-05 Dow Chemical Co Fill point determination
JPS53106146A (en) * 1977-02-25 1978-09-14 Ericsson Telefon Ab L M Adjusting connector for light conducting fiber tube

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3409709A (en) * 1964-07-23 1968-11-05 Dow Chemical Co Fill point determination
JPS53106146A (en) * 1977-02-25 1978-09-14 Ericsson Telefon Ab L M Adjusting connector for light conducting fiber tube

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575181A (en) * 1983-04-26 1986-03-11 Tokyo Shibaura Denki Kabushiki Kaisha Optical fiber assembly with cladding light scattering means
JPS608813A (en) * 1983-06-10 1985-01-17 ジ−メンス・アクチエンゲゼルシヤフト Optical fiber connector
EP0732781A1 (en) * 1995-03-14 1996-09-18 Tesa Brown & Sharpe S.A. Module comprising a controlled diode laser and electrooptical device using the same
EP1096285A2 (en) * 1999-11-01 2001-05-02 GSI Lumonics Ltd. Laser to optical fibre coupling
EP1096285A3 (en) * 1999-11-01 2004-05-06 GSI Lumonics Ltd. Laser to optical fibre coupling
US7200289B2 (en) 2000-03-15 2007-04-03 Sumitomo Osaka Cement Co., Ltd. Optical waveguide modulator with output light monitor
US7359581B2 (en) 2000-03-15 2008-04-15 Sumitomo Osaka Cement Co., Ltd. Optical waveguide modulator with output light monitor
US7532778B2 (en) 2000-03-15 2009-05-12 Sumitomo Osaka Cement Co., Ltd. Optical waveguide modulator equipped with an output light monitor
EP1329998A1 (en) * 2002-01-21 2003-07-23 Agilent Technologies, Inc. (a Delaware corporation) An arrangement for monitoring the emission wavelength of a laser source

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