JPS55125612A - Molded coil - Google Patents
Molded coilInfo
- Publication number
- JPS55125612A JPS55125612A JP3400479A JP3400479A JPS55125612A JP S55125612 A JPS55125612 A JP S55125612A JP 3400479 A JP3400479 A JP 3400479A JP 3400479 A JP3400479 A JP 3400479A JP S55125612 A JPS55125612 A JP S55125612A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- conductor
- molding
- cushion material
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Insulating Of Coils (AREA)
Abstract
PURPOSE:To prevent a molding resin from cracking, by interposing a cushion material between a coil and the resin and then performing molding. CONSTITUTION:A coil conductor 1 is coated with a rubber cushion material. This material is coated with a resin 2. The conductor is then wound around a core 3. The thermal expansion coefficient of the metal conductor is smaller than that of the molding resin. When the metal conductor is Al and the molding resin is epoxy resin and the length of the conductor is 500mm, the expansion difference between the conductor 1 and the resin layer is 0.4mm under a temperature difference of 100 deg.C. For this resin, the cushion material 4 is provided at a thickness of 2mm on one side so that the expansion coefficent of 0.2mm on one side is absorbed. Therefore, no stress is caused and the resin layer 2 is prevented from cracking.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3400479A JPS55125612A (en) | 1979-03-22 | 1979-03-22 | Molded coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3400479A JPS55125612A (en) | 1979-03-22 | 1979-03-22 | Molded coil |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55125612A true JPS55125612A (en) | 1980-09-27 |
Family
ID=12402286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3400479A Pending JPS55125612A (en) | 1979-03-22 | 1979-03-22 | Molded coil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55125612A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010147364A (en) * | 2008-12-22 | 2010-07-01 | Denso Corp | Reactor |
JP2010245111A (en) * | 2009-04-01 | 2010-10-28 | Nec Tokin Corp | Reactor |
-
1979
- 1979-03-22 JP JP3400479A patent/JPS55125612A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010147364A (en) * | 2008-12-22 | 2010-07-01 | Denso Corp | Reactor |
JP2010245111A (en) * | 2009-04-01 | 2010-10-28 | Nec Tokin Corp | Reactor |
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