JPS55120475A - Brazing method of copper - Google Patents
Brazing method of copperInfo
- Publication number
- JPS55120475A JPS55120475A JP2642979A JP2642979A JPS55120475A JP S55120475 A JPS55120475 A JP S55120475A JP 2642979 A JP2642979 A JP 2642979A JP 2642979 A JP2642979 A JP 2642979A JP S55120475 A JPS55120475 A JP S55120475A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- copper
- flow
- brazing
- copper material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To improve the flow of braze and obtain defect-free brazing even without flux by electrolytically polishing at least the portions to be brazed of copper material, and removing cuprous oxide from the surfaces thereof then performing brazing in a furnace of a nonoxidiative atmosphere.
CONSTITUTION: When copper material 1 is electrolytically polished, the one which had exposed on the surface 7 out of the Cu2O3 existing therein becomes perfectly none. As a result of this, the flow of braze becomes good, but in order to obtain much better flow, a copper plating layer 8 is applied to a thickness 2μ or more on the surface 7 after the electrolytic polishing or preferably, the underlying plating layer 9 is made 2μ thick or more and on this is applied a copper plating layer 10 to a thickness 2μ or more. The copper material to be used whose oxygen content is 0.002% or less is desirable for prevention of hydrogen brittleness in view of the fact that in-furnace brazing is in many cases accomplished in the atmospheres containing hydrogen.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2642979A JPS55120475A (en) | 1979-03-06 | 1979-03-06 | Brazing method of copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2642979A JPS55120475A (en) | 1979-03-06 | 1979-03-06 | Brazing method of copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55120475A true JPS55120475A (en) | 1980-09-16 |
Family
ID=12193261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2642979A Pending JPS55120475A (en) | 1979-03-06 | 1979-03-06 | Brazing method of copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55120475A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5018662A (en) * | 1990-02-26 | 1991-05-28 | P & J Industries, Inc. | Coating and brazing technique |
| JP2010120034A (en) * | 2008-11-18 | 2010-06-03 | Nhk Spring Co Ltd | Brazing method and joined member thereby |
| CN104625278A (en) * | 2013-11-12 | 2015-05-20 | 联合汽车电子有限公司 | Method for manufacturing products by cast components through copper brazing |
-
1979
- 1979-03-06 JP JP2642979A patent/JPS55120475A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5018662A (en) * | 1990-02-26 | 1991-05-28 | P & J Industries, Inc. | Coating and brazing technique |
| JP2010120034A (en) * | 2008-11-18 | 2010-06-03 | Nhk Spring Co Ltd | Brazing method and joined member thereby |
| DE102009053666B4 (en) * | 2008-11-18 | 2015-05-28 | Nhk Spring Co., Ltd. | Soldering and composite components, which are connected by this method |
| CN104625278A (en) * | 2013-11-12 | 2015-05-20 | 联合汽车电子有限公司 | Method for manufacturing products by cast components through copper brazing |
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