JPS55119142A - Electric contact point - Google Patents

Electric contact point

Info

Publication number
JPS55119142A
JPS55119142A JP2793679A JP2793679A JPS55119142A JP S55119142 A JPS55119142 A JP S55119142A JP 2793679 A JP2793679 A JP 2793679A JP 2793679 A JP2793679 A JP 2793679A JP S55119142 A JPS55119142 A JP S55119142A
Authority
JP
Japan
Prior art keywords
contact point
layer
electric contact
undercoating
matrix material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2793679A
Other languages
Japanese (ja)
Inventor
Masayuki Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2793679A priority Critical patent/JPS55119142A/en
Publication of JPS55119142A publication Critical patent/JPS55119142A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To operate an electric contact point from low load to high load under relatively low contact pressure accurately in long useful life by constituting an electric contact from an Au-Pd alloy contact point layer adhered to a contact point matrix material through Cu, Ni and Au strike plating layer.
CONSTITUTION: An undercoating 9 constituted from two layers of a Cu layer 7 and an Ni layer 6 to a surface of a contact point matrix material 8 such as Fe or the like and, onto this undercoating 9, is formed an Au strike plating layer 5 with thickness of 0.1μm and, moreover, an Au-Pd alloy contact point layer 1 comprising columnar structure 3 containing Pd: 10W50% is formed thereon in the thickness of 1W15μm by a sputtering method. Because a contact point layer 1 is a columnar structure 3, even if the said layer is consumed by spark or the like, a new contact point surface 2 similar to an initial surface is developed always and an excellent contact point property is maintained at all times.
COPYRIGHT: (C)1980,JPO&Japio
JP2793679A 1979-03-09 1979-03-09 Electric contact point Pending JPS55119142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2793679A JPS55119142A (en) 1979-03-09 1979-03-09 Electric contact point

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2793679A JPS55119142A (en) 1979-03-09 1979-03-09 Electric contact point

Publications (1)

Publication Number Publication Date
JPS55119142A true JPS55119142A (en) 1980-09-12

Family

ID=12234773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2793679A Pending JPS55119142A (en) 1979-03-09 1979-03-09 Electric contact point

Country Status (1)

Country Link
JP (1) JPS55119142A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8637165B2 (en) 2011-09-30 2014-01-28 Apple Inc. Connector with multi-layer Ni underplated contacts
WO2014025416A1 (en) * 2012-08-10 2014-02-13 Apple Inc. Connector with gold-palladium plated contacts
CN111394606A (en) * 2020-05-06 2020-07-10 贵研铂业股份有限公司 Gold-based high-resistance alloy, alloy material and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8637165B2 (en) 2011-09-30 2014-01-28 Apple Inc. Connector with multi-layer Ni underplated contacts
WO2014025416A1 (en) * 2012-08-10 2014-02-13 Apple Inc. Connector with gold-palladium plated contacts
US9004960B2 (en) 2012-08-10 2015-04-14 Apple Inc. Connector with gold-palladium plated contacts
CN111394606A (en) * 2020-05-06 2020-07-10 贵研铂业股份有限公司 Gold-based high-resistance alloy, alloy material and preparation method thereof
CN111394606B (en) * 2020-05-06 2021-03-16 贵研铂业股份有限公司 Gold-based high-resistance alloy, alloy material and preparation method thereof

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