JPS55115988A - Production of differential thickness plated metal plate - Google Patents

Production of differential thickness plated metal plate

Info

Publication number
JPS55115988A
JPS55115988A JP2295279A JP2295279A JPS55115988A JP S55115988 A JPS55115988 A JP S55115988A JP 2295279 A JP2295279 A JP 2295279A JP 2295279 A JP2295279 A JP 2295279A JP S55115988 A JPS55115988 A JP S55115988A
Authority
JP
Japan
Prior art keywords
metal plate
plating
plated
cell
contacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2295279A
Other languages
Japanese (ja)
Inventor
Takashi Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2295279A priority Critical patent/JPS55115988A/en
Publication of JPS55115988A publication Critical patent/JPS55115988A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To control the plate thickness of the metal plate to be plated respectively independeltly for the front and back and inexpensively produce the perfect differential thickness plated metal plate by closely contacting plastic non-metallic magnets at one or more places on the surface of the material to be plated under plating process.
CONSTITUTION: The metal plate to be plated 2 is contacted with a strip-from rubber magnet 1 in the guide roll 3a portion and while the contact state is being maintained, it is admitted into a plating cell 4. At the place of the guide roll 3c in the cell 4, the contact state is released; thereafter the metal plate 2 alone is delivered to outside the cell 4. In this case, the both are contacted closely by the strong attraction force acting between the metal plate 2 and magnet 1 so that the entry of the plating solution 6 into the contact portion 5 is prevented, and while it is passing the (a) and (b) portions, no plating is deposited on the fixing surface and only the other exposing surface is plated. As a result of this, the differences in the plating thickness proportional to the ratios between the effective lengths (a), (d) of the plating line and the lengths (a), (b) of the contacted materials are produced on the front and back of the metal plate 2, whereby the intended differential thickness plated material is obtained. Here, 7 in the figure denotes a drive roller and 8 an electrode for plating.
COPYRIGHT: (C)1980,JPO&Japio
JP2295279A 1979-02-28 1979-02-28 Production of differential thickness plated metal plate Pending JPS55115988A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2295279A JPS55115988A (en) 1979-02-28 1979-02-28 Production of differential thickness plated metal plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2295279A JPS55115988A (en) 1979-02-28 1979-02-28 Production of differential thickness plated metal plate

Publications (1)

Publication Number Publication Date
JPS55115988A true JPS55115988A (en) 1980-09-06

Family

ID=12096943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2295279A Pending JPS55115988A (en) 1979-02-28 1979-02-28 Production of differential thickness plated metal plate

Country Status (1)

Country Link
JP (1) JPS55115988A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669889A (en) * 1979-11-12 1981-06-11 Fujitsu Ltd Method of plating printed circuit board
JP2016098403A (en) * 2014-11-21 2016-05-30 Jfeスチール株式会社 Electroplating method, electrode roll, and electroplating apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669889A (en) * 1979-11-12 1981-06-11 Fujitsu Ltd Method of plating printed circuit board
JPS635916B2 (en) * 1979-11-12 1988-02-05 Fujitsu Ltd
JP2016098403A (en) * 2014-11-21 2016-05-30 Jfeスチール株式会社 Electroplating method, electrode roll, and electroplating apparatus

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