JPS55113340A - Feeder for semiconductor-mounting substrate - Google Patents

Feeder for semiconductor-mounting substrate

Info

Publication number
JPS55113340A
JPS55113340A JP1947179A JP1947179A JPS55113340A JP S55113340 A JPS55113340 A JP S55113340A JP 1947179 A JP1947179 A JP 1947179A JP 1947179 A JP1947179 A JP 1947179A JP S55113340 A JPS55113340 A JP S55113340A
Authority
JP
Japan
Prior art keywords
tray
linking hole
mounting
element mounting
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1947179A
Other languages
Japanese (ja)
Other versions
JPS6140132B2 (en
Inventor
Teruo Kusakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1947179A priority Critical patent/JPS55113340A/en
Publication of JPS55113340A publication Critical patent/JPS55113340A/en
Publication of JPS6140132B2 publication Critical patent/JPS6140132B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To insure mounting by a method wherein a table having a vacuum-drawing linking hole is placed on an XY stage via a table holder, and a plurality of semiconductor element mounting substrates are neatly aligned on this by using a tray.
CONSTITUTION: Table holder 21 provided with vacuum-drawing linking hole 22, which is caused to slide freely by guide rod 24, is placed on XY table 25. On top of this is placed table 11 having a linking hole connected to linking hole 22. Table 11 is provided with many crosswise projections 19 for mounting semiconductor element mounting substrates 12. Element mounting substrates 12 are supplied to these mounting units 19 by using tray 15. That is, leads 18 formed on the back of the substrate is projected into holes 16 provided on tray 15 and each substrate 12 is positioned on table 11 by means of guide pin 14 provided on table 11. Then, tray 15 is withdrawn.
COPYRIGHT: (C)1980,JPO&Japio
JP1947179A 1979-02-21 1979-02-21 Feeder for semiconductor-mounting substrate Granted JPS55113340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1947179A JPS55113340A (en) 1979-02-21 1979-02-21 Feeder for semiconductor-mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1947179A JPS55113340A (en) 1979-02-21 1979-02-21 Feeder for semiconductor-mounting substrate

Publications (2)

Publication Number Publication Date
JPS55113340A true JPS55113340A (en) 1980-09-01
JPS6140132B2 JPS6140132B2 (en) 1986-09-08

Family

ID=12000232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1947179A Granted JPS55113340A (en) 1979-02-21 1979-02-21 Feeder for semiconductor-mounting substrate

Country Status (1)

Country Link
JP (1) JPS55113340A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113950635A (en) * 2019-06-14 2022-01-18 思科技术公司 Tray and clamp structure for opto-mechanical component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113950635A (en) * 2019-06-14 2022-01-18 思科技术公司 Tray and clamp structure for opto-mechanical component
CN113950635B (en) * 2019-06-14 2023-12-08 思科技术公司 Tray and clamp structure for optomechanical components

Also Published As

Publication number Publication date
JPS6140132B2 (en) 1986-09-08

Similar Documents

Publication Publication Date Title
JPS5355597A (en) Device for horizontally moving working table or spindle
JPS55113340A (en) Feeder for semiconductor-mounting substrate
JPS526465A (en) Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPS53570A (en) Aligning apparatus for rod-like articles
JPS5385159A (en) Production of using semiconductor support and semiconductor device usingsemiconductor support
JPS5627753A (en) Part mounting method and device for printed board
JPS52150879A (en) Positioning device for plate supply
JPS5342659A (en) Semiconductor integrated circuit
JPS5362443A (en) Multi channel time control system
JPS51141112A (en) Floating face plate for transportation
JPS55157245A (en) Mass producing method of integrated circuit
JPS5323483A (en) Automatic loading devic e
JPS5243373A (en) Jigs for apparatus of producing a semiconductor
JPS54280A (en) Positioning device
JPS53100572A (en) Apparatus for feeding predetermined amount of luggages
JPS53107272A (en) Film substrate for semiconductor device
JPS5426666A (en) Positioning method of semiconductor wafer
JPS5377386A (en) Device for inserting electronic parts automatically
JPS5336172A (en) Inclined transfer mounting machine
JPS5322373A (en) Solder d isc feeder to wafers
JPS53121468A (en) Manufacture for semiconductor device
JPS53116578A (en) Apparatus for conveying and inserting electronic part
JPS5598834A (en) Automatic feeder for electronic part
JPS5392663A (en) Semiconductor device
JPS51151089A (en) Manufacturing method of a semiconductor