JPS55105337A - Method for wire bonding - Google Patents

Method for wire bonding

Info

Publication number
JPS55105337A
JPS55105337A JP1186879A JP1186879A JPS55105337A JP S55105337 A JPS55105337 A JP S55105337A JP 1186879 A JP1186879 A JP 1186879A JP 1186879 A JP1186879 A JP 1186879A JP S55105337 A JPS55105337 A JP S55105337A
Authority
JP
Japan
Prior art keywords
ordinates
bonding
movement
stroke
completion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1186879A
Other languages
Japanese (ja)
Inventor
Kazuo Kachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1186879A priority Critical patent/JPS55105337A/en
Publication of JPS55105337A publication Critical patent/JPS55105337A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE: To ensure confirmation of the co-ordinates, by providing an XY-movement measuring device on an XY-movement table constituting a bonding device, adding the signal therefrom to an operating device at every completion of one stroke, and comparing the signal with predetermined position information.
CONSTITUTION: A bonding head 13 is mounted on an XY table 11, from which a bonding arm 12a is protruded so that it can move up and down on a support 12d. A bonding tool 12, at the end of which a wire is pierced is provided. Under the table 11, a linear encoder head 21 and a linear encoder scale 22 are provided, and the output therefrom is sent to a measuring device 23 where the local co-ordinates are obtained. Then, the co-ordinates are compared with a specified co-ordinates values in an operating device 24. Thereafter, a pulse motor 16 is operated by the output via an output device 25 for a compensating amount of movement. The table 11 is moved with the co-ordinates being confirmed by an optical sensor 18 and an original-point-confirming cam 17, thereby the position is controlled at every completion of a stroke.
COPYRIGHT: (C)1980,JPO&Japio
JP1186879A 1979-02-06 1979-02-06 Method for wire bonding Pending JPS55105337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1186879A JPS55105337A (en) 1979-02-06 1979-02-06 Method for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1186879A JPS55105337A (en) 1979-02-06 1979-02-06 Method for wire bonding

Publications (1)

Publication Number Publication Date
JPS55105337A true JPS55105337A (en) 1980-08-12

Family

ID=11789692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1186879A Pending JPS55105337A (en) 1979-02-06 1979-02-06 Method for wire bonding

Country Status (1)

Country Link
JP (1) JPS55105337A (en)

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