JPS55104366A - Conductive paint for microelectronic circuit package - Google Patents

Conductive paint for microelectronic circuit package

Info

Publication number
JPS55104366A
JPS55104366A JP1162779A JP1162779A JPS55104366A JP S55104366 A JPS55104366 A JP S55104366A JP 1162779 A JP1162779 A JP 1162779A JP 1162779 A JP1162779 A JP 1162779A JP S55104366 A JPS55104366 A JP S55104366A
Authority
JP
Japan
Prior art keywords
gold
silver
paint
conductive component
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1162779A
Other languages
Japanese (ja)
Inventor
Eiichi Asada
Katsuhiko Kenmochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Priority to JP1162779A priority Critical patent/JPS55104366A/en
Publication of JPS55104366A publication Critical patent/JPS55104366A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: Title paint which contains a silver-added gold paint and is capable of producing films which can rapidly be baked into uniform, dense conductive films capable of tightly contacting with substrates and free from the problem of the formation of gold/silicon particles and the lifting of inorganic binders.
CONSTITUTION: The conductive paint for microelectronic circuit package comprises 100pts.wt. of a conductive component consisting of 99.9W80wt% of gold and 0.1W 20wt% of silver; 1W10pts.wt. of an inorganic binder; and an organic vehicle. The conductive component can be that which forms alloy on baking the paint. Examples of the conductive component include gold powder, silver powder, gold/silver alloy powder, coated composite powder and mixtures thereof. And also, part of the conductive component can be replaced with organic gold or silver compounds which, when heat-treated, can decompose and deposit the metals. Such organometallic compounds are, e.g., naphthenates, mercaptides, etc.
COPYRIGHT: (C)1980,JPO&Japio
JP1162779A 1979-02-02 1979-02-02 Conductive paint for microelectronic circuit package Pending JPS55104366A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1162779A JPS55104366A (en) 1979-02-02 1979-02-02 Conductive paint for microelectronic circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1162779A JPS55104366A (en) 1979-02-02 1979-02-02 Conductive paint for microelectronic circuit package

Publications (1)

Publication Number Publication Date
JPS55104366A true JPS55104366A (en) 1980-08-09

Family

ID=11783160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1162779A Pending JPS55104366A (en) 1979-02-02 1979-02-02 Conductive paint for microelectronic circuit package

Country Status (1)

Country Link
JP (1) JPS55104366A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107572922A (en) * 2017-09-21 2018-01-12 苏州振振好新型建材科技有限公司 A kind of colorful true mineral varnish of inorganic thermal insulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107572922A (en) * 2017-09-21 2018-01-12 苏州振振好新型建材科技有限公司 A kind of colorful true mineral varnish of inorganic thermal insulation

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