JPS55103796A - Method of fabricating high packing density multilayer wiring ceramic substrate - Google Patents

Method of fabricating high packing density multilayer wiring ceramic substrate

Info

Publication number
JPS55103796A
JPS55103796A JP1162579A JP1162579A JPS55103796A JP S55103796 A JPS55103796 A JP S55103796A JP 1162579 A JP1162579 A JP 1162579A JP 1162579 A JP1162579 A JP 1162579A JP S55103796 A JPS55103796 A JP S55103796A
Authority
JP
Japan
Prior art keywords
ceramic substrate
multilayer wiring
packing density
high packing
fabricating high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1162579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6239558B2 (enrdf_load_stackoverflow
Inventor
Isao Masuda
Asao Morikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP1162579A priority Critical patent/JPS55103796A/ja
Publication of JPS55103796A publication Critical patent/JPS55103796A/ja
Publication of JPS6239558B2 publication Critical patent/JPS6239558B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1162579A 1979-02-02 1979-02-02 Method of fabricating high packing density multilayer wiring ceramic substrate Granted JPS55103796A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1162579A JPS55103796A (en) 1979-02-02 1979-02-02 Method of fabricating high packing density multilayer wiring ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1162579A JPS55103796A (en) 1979-02-02 1979-02-02 Method of fabricating high packing density multilayer wiring ceramic substrate

Publications (2)

Publication Number Publication Date
JPS55103796A true JPS55103796A (en) 1980-08-08
JPS6239558B2 JPS6239558B2 (enrdf_load_stackoverflow) 1987-08-24

Family

ID=11783101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1162579A Granted JPS55103796A (en) 1979-02-02 1979-02-02 Method of fabricating high packing density multilayer wiring ceramic substrate

Country Status (1)

Country Link
JP (1) JPS55103796A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814598A (ja) * 1981-07-17 1983-01-27 日本電気株式会社 配線基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814598A (ja) * 1981-07-17 1983-01-27 日本電気株式会社 配線基板の製造方法

Also Published As

Publication number Publication date
JPS6239558B2 (enrdf_load_stackoverflow) 1987-08-24

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